Inventor · disambiguated record
Kengo Kaminaga
Also filed as: KAMINAGA KENGO
6 granted patents·11 pending applications·31 citations·filing 2009–2022
76Inventor score
Files withJX NIPPON MINING & METALS CORP8YAMANISHI KEISUKE4MORIYAMA TERUMASA2ARAI HIDETA1JX ADVANCED METALS CORP1
Top patents by PatentIndex Score
17 records- 0190US9060431B2Liquid crystal polymer copper-clad laminate and copper foil used for said laminateARAI HIDETA·Filed 2012·Granted Jun 16, 2015·7 cites·34 claims
- 0285US8142905B2Copper foil for printed circuit board and copper clad laminate for printed circuit boardMORIYAMA TERUMASA·Filed 2009·Granted Mar 27, 2012·22 cites·16 claims
- 0366US8357307B2Method of forming electronic circuitJX NIPPON MINING & METALS CORP·Filed 2009·Granted Jan 22, 2013·2 cites·13 claims
- 0460US2024417845A1Sputtering Target And Method For Manufacturing The SameJX ADVANCED METALS CORP·Filed 2022·Application pending·0 cites
- 0560US2018261438A1Tungsten Sintered Compact Sputtering Target and Tungsten Film Formed Using Said TargetJX NIPPON MINING & METALS CORP·Filed 2018·Application pending·0 cites
- 0658US8668994B2Rolled copper foil or electrolytic copper foil for electronic circuit, and method of forming electronic circuit using sameYAMANISHI KEISUKE·Filed 2009·Granted Mar 11, 2014·0 cites·19 claims
- 0756US2015303040A1Tungsten Sintered Compact Sputtering Target and Tungsten Film Formed Using Said TargetJX NIPPON MINING & METALS CORP·Filed 2013·Application pending·0 cites
- 0854US12054822B2Sputtering target product and method for producing recycled sputtering target productJX NIPPON MINING & METALS CORP·Filed 2020·Granted Aug 6, 2024·0 cites·16 claims
- 0950US2011259848A1Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit Using SameJX NIPPON MINING & METALS CORP·Filed 2009·Application pending·0 cites
- 1048US2021010149A1Co Anode, And Co Electroplating Method Using Co AnodeJX NIPPON MINING & METALS CORP·Filed 2018·Application pending·0 cites
- 1148US2013270218A1Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit Using SameJX NIPPON MINING & METALS CORP·Filed 2013·Application pending·0 cites
- 1245US2013011734A1Copper foil for negative electrode current collector of secondary batteryJX NIPPON MINING & METALS CORP·Filed 2011·Application pending·0 cites
- 1343US2011300401A1Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit using sameYAMANISHI KEISUKE·Filed 2010·Application pending·0 cites
- 1441US2012148862A1Copper Foil for Printed Circuit Board and Copper Clad Laminate for Printed Circuit BoardMORIYAMA TERUMASA·Filed 2012·Application pending·0 cites
- 1540US8580390B2Rolled copper foil or electrolytic copper foil for electronic circuit, and method of forming electronic circuit using sameYAMANISHI KEISUKE·Filed 2009·Granted Nov 12, 2013·0 cites·19 claims
- 1639US2012318568A1Electronic circuit, method for forming same, and copper clad laminate for forming electronic circuitYAMANISHI KEISUKE·Filed 2011·Application pending·0 cites
- 1736US2012135266A1Copper Foil and Method for Producing SameKAMINAGA KENGO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →