Inventor · disambiguated record
Keren Jacobs Kanarik
Also filed as: KANARIK KEREN J · KANARIK KEREN JACOBS
30 granted patents·9 pending applications·515 citations·filing 2006–2024
97Inventor score
Top patents by PatentIndex Score
39 records- 0199US11721558B2Designer atomic layer etchingLAM RES CORP·Filed 2021·Granted Aug 8, 2023·7 cites·10 claims
- 0298US11069535B2Atomic layer etch of tungsten for enhanced tungsten deposition fillLAM RES CORP·Filed 2020·Granted Jul 20, 2021·7 cites·19 claims
- 0398US10566212B2Designer atomic layer etchingLAM RES CORP·Filed 2017·Granted Feb 18, 2020·26 cites·9 claims
- 0498US9805941B2Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch)LAM RES CORP·Filed 2017·Granted Oct 31, 2017·44 cites·26 claims
- 0598US9576811B2Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch)LAM RES CORP·Filed 2015·Granted Feb 21, 2017·65 cites·26 claims
- 0698US8883028B2Mixed mode pulsing etching in plasma processing systemsKANARIK KEREN JACOBS·Filed 2012·Granted Nov 11, 2014·83 cites·23 claims
- 0798US8808561B2Inert-dominant pulsing in plasma processing systemsKANARIK KEREN JACOBS·Filed 2012·Granted Aug 19, 2014·70 cites·24 claims
- 0897US11239094B2Designer atomic layer etchingLAM RES CORP·Filed 2019·Granted Feb 1, 2022·13 cites·11 claims
- 0997US10186426B2Integrating atomic scale processes: ALD (atomic layer deposition) and ale (atomic layer etch)LAM RES CORP·Filed 2017·Granted Jan 22, 2019·16 cites·21 claims
- 1097US10096487B2Atomic layer etching of tungsten and other metalsLAM RES CORP·Filed 2016·Granted Oct 9, 2018·24 cites·16 claims
- 1197US9972504B2Atomic layer etching of tungsten for enhanced tungsten deposition fillLAM RES CORP·Filed 2015·Granted May 15, 2018·21 cites·19 claims
- 1297US9837312B1Atomic layer etching for enhanced bottom-up feature fillLAM RES CORP·Filed 2016·Granted Dec 5, 2017·48 cites·20 claims
- 1396US10763083B2High energy atomic layer etchingLAM RES CORP·Filed 2018·Granted Sep 1, 2020·15 cites·22 claims
- 1496US10566213B2Atomic layer etching of tantalumLAM RES CORP·Filed 2018·Granted Feb 18, 2020·14 cites·7 claims
- 1595US10056264B2Atomic layer etching of GaN and other III-V materialsLAM RES CORP·Filed 2016·Granted Aug 21, 2018·20 cites·20 claims
- 1695US9984858B2ALE smoothness: in and outside semiconductor industryLAM RES CORP·Filed 2016·Granted May 29, 2018·10 cites·20 claims
- 1794US12119243B2Plasma etching chemistries of high aspect ratio features in dielectricsLAM RES CORP·Filed 2023·Granted Oct 15, 2024·1 cites·5 claims
- 1894US10515816B2Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch)LAM RES CORP·Filed 2018·Granted Dec 24, 2019·6 cites·18 claims
- 1989US10727073B2Atomic layer etching 3D structures: Si and SiGe and Ge smoothness on horizontal and vertical surfacesLAM RES CORP·Filed 2017·Granted Jul 28, 2020·5 cites·20 claims
- 2089US10304659B2Ale smoothness: in and outside semiconductor industryLAM RES CORP·Filed 2018·Granted May 28, 2019·4 cites·20 claims
- 2184US11450513B2Atomic layer etching and smoothing of refractory metals and other high surface binding energy materialsLAM RES CORP·Filed 2019·Granted Sep 20, 2022·3 cites·7 claims
- 2281US2020161139A1Integrating atomic scale processes: ald (atomic layer deposition) and ale (atomic layer etch)LAM RES CORP·Filed 2019·Application pending·0 cites
- 2381US2024178014A1Plasma etching chemistries of high aspect ratio features in dielectricsLAM RES CORP·Filed 2024·Application pending·0 cites
- 2477US11594429B2Plasma etching chemistries of high aspect ratio features in dielectricsLAM RES CORP·Filed 2019·Granted Feb 28, 2023·1 cites·12 claims
- 2577US9214320B2Inert-dominant pulsing in plasma processing systemsLAM RES CORP·Filed 2014·Granted Dec 15, 2015·2 cites·20 claims
- 2677US7682480B2Photoresist conditioning with hydrogen rampingLAM RES CORP·Filed 2006·Granted Mar 23, 2010·5 cites·15 claims
- 2777US2024274408A1High energy atomic layer etchingLAM RES CORP·Filed 2024·Application pending·0 cites
- 2874US2022115244A1Atomic layer etching of tungsten for enhanced tungsten deposition fillLAM RES CORP·Filed 2021·Application pending·0 cites
- 2973US8206996B2Etch tool process indicator method and apparatusKANARIK KEREN JACOBS·Filed 2009·Granted Jun 26, 2012·2 cites·17 claims
- 3072US2021305059A1Atomic layer etching of tungsten for enhanced tungsten deposition fillLAM RES CORP·Filed 2021·Application pending·0 cites
- 3167US7951616B2Process for wafer temperature verification in etch toolsLAM RES CORP·Filed 2009·Granted May 31, 2011·2 cites·16 claims
- 3266US8492174B2Etch tool process indicator method and apparatusKANARIK KEREN JACOBS·Filed 2012·Granted Jul 23, 2013·1 cites·16 claims
- 3366US2022392747A1Atomic layer etching and smoothing of refractory metals and other high surface binding energy materialsLAM RES CORP·Filed 2022·Application pending·0 cites
- 3463US2020402770A1High energy atomic layer etchingLAM RES CORP·Filed 2020·Application pending·0 cites
- 3561US9425025B2Mixed mode pulsing etching in plasma processing systemsLAM RES CORP·Filed 2014·Granted Aug 23, 2016·0 cites·34 claims
- 3659US10121639B2Mixed mode pulsing etching in plasma processing systemsLAM RES CORP·Filed 2016·Granted Nov 6, 2018·0 cites·20 claims
- 3758US2018240682A1Atomic layer etch of tungsten for enhanced tungsten deposition fillLAM RES CORP·Filed 2018·Application pending·0 cites
- 3857US9583316B2Inert-dominant pulsing in plasma processing systemsLAM RES CORP·Filed 2015·Granted Feb 28, 2017·0 cites·11 claims
- 3941US2013119018A1Hybrid pulsing plasma processing systemsKANARIK KEREN JACOBS·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →