Inventor · disambiguated record
Kenshi Kanegae
Also filed as: KANEGAE KENSHI
13 granted patents·3 pending applications·98 citations·filing 2001–2012
89Inventor score
Top patents by PatentIndex Score
16 records- 0192US6632746B2Etching method, semiconductor and fabricating method for the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Oct 14, 2003·51 cites·23 claims
- 0283US7964918B2Semiconductor device and method for manufacturing the samePANASONIC CORP·Filed 2008·Granted Jun 21, 2011·11 cites·22 claims
- 0373US6831018B2Method for fabricating semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Dec 14, 2004·18 cites·15 claims
- 0470US7282452B2Etching method, semiconductor and fabricating method for the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Oct 16, 2007·9 cites·12 claims
- 0568US7985691B2Etching method, semiconductor and fabricating method for the samePANASONIC CORP·Filed 2010·Granted Jul 26, 2011·1 cites·15 claims
- 0667US7884428B2Semiconductor device and method for manufacturing the samePANASONIC CORP·Filed 2008·Granted Feb 8, 2011·3 cites·28 claims
- 0766US8084826B2Semiconductor device and manufacturing method thereofKANEGAE KENSHI·Filed 2009·Granted Dec 27, 2011·4 cites·20 claims
- 0859US7973367B2Semiconductor device and manufacturing method thereofPANASONIC CORP·Filed 2009·Granted Jul 5, 2011·0 cites·27 claims
- 0957US8994125B2Semiconductor device including a field effect transistorKANEGAE KENSHI·Filed 2012·Granted Mar 31, 2015·1 cites·24 claims
- 1051US7732339B2Etching method, semiconductor and fabricating method for the samePANASONIC CORP·Filed 2005·Granted Jun 8, 2010·0 cites·7 claims
- 1151US7663191B2Semiconductor device and manufacturing method thereof with rounded gate including a silicide on the top and at the cornersPANASONIC CORP·Filed 2005·Granted Feb 16, 2010·0 cites·18 claims
- 1250US8242567B2Semiconductor device and manufacturing method thereofKANEGAE KENSHI·Filed 2011·Granted Aug 14, 2012·0 cites·8 claims
- 1345US2010078730A1Semiconductor device and manufacturing method thereofPANASONIC CORP·Filed 2009·Application pending·0 cites
- 1438US2007138573A1Semiconductor device and manufacturing method of the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 1537US2006222235A1Defect inspection methodKANEGAE KENSHI·Filed 2006·Application pending·0 cites
- 1636US6664181B2Method for fabricating semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Dec 16, 2003·0 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →