Inventor · disambiguated record
Kenneth Kaskoun
Also filed as: KASKOUN KENNETH
33 granted patents·8 pending applications·941 citations·filing 1995–2020
97Inventor score
Top patents by PatentIndex Score
41 records- 0198US6624005B1Semiconductor memory cards and method of making sameAMKOR TECHNOLOGY INC·Filed 2000·Granted Sep 23, 2003·304 cites·3 claims
- 0297US5661088AElectronic component and method of packagingMOTOROLA INC·Filed 1996·Granted Aug 26, 1997·175 cites·19 claims
- 0394US10667751B2Methods, devices and systems for sensor with removable nodesCAPSULE TECH INC·Filed 2018·Granted Jun 2, 2020·28 cites·10 claims
- 0493US9955939B2Stethoscope system including a sensor arrayQUALCOMM INC·Filed 2016·Granted May 1, 2018·37 cites·30 claims
- 0590US7939926B2Via first plus via last technique for IC interconnectsQUALCOMM INC·Filed 2008·Granted May 10, 2011·15 cites·12 claims
- 0688US10271745B2Monolithic integrated emitter-detector array in a flexible substrate for biometric sensingQUALCOMM INC·Filed 2016·Granted Apr 30, 2019·8 cites·26 claims
- 0788US9974484B2Methods, devices and systems for sensor with removable nodesQUALCOMM INC·Filed 2016·Granted May 22, 2018·8 cites·16 claims
- 0885US5860585ASubstrate for transferring bumps and method of useMOTOROLA INC·Filed 1996·Granted Jan 19, 1999·71 cites·14 claims
- 0983US7985620B2Method of fabricating via first plus via last IC interconnectQUALCOMM INC·Filed 2010·Granted Jul 26, 2011·5 cites·14 claims
- 1081US9721409B2Biometrics for user identification in mobile health systemsQUALCOMM INC·Filed 2014·Granted Aug 1, 2017·8 cites·17 claims
- 1181US6409073B1Method for transfering solder to a device and/or testing the deviceFRAUNHOFER GES FORSCHUNG·Filed 1999·Granted Jun 25, 2002·96 cites·10 claims
- 1281US5816478AFluxless flip-chip bond and a method for makingMOTOROLA INC·Filed 1995·Granted Oct 6, 1998·64 cites·8 claims
- 1380US9615794B2Method, devices and systems for sensor with removable nodesQUALCOMM INC·Filed 2013·Granted Apr 11, 2017·9 cites·9 claims
- 1478US9138191B1Integrated circuit module with lead frame micro-needlesQUALCOMM INC·Filed 2014·Granted Sep 22, 2015·7 cites·10 claims
- 1578US6166556AMethod for testing a semiconductor device and semiconductor device tested therebyMOTOROLA INC·Filed 1998·Granted Dec 26, 2000·58 cites·5 claims
- 1672US10506977B2Method, devices and systems for sensor with removable nodesCAPSULE TECH INC·Filed 2017·Granted Dec 17, 2019·1 cites·17 claims
- 1767US8080862B2Systems and methods for enabling ESD protection on 3-D stacked devicesKASKOUN KENNETH·Filed 2008·Granted Dec 20, 2011·3 cites·11 claims
- 1866US10025917B2Biometrics for user identification in mobile health systemsQUALCOMM INC·Filed 2017·Granted Jul 17, 2018·1 cites·20 claims
- 1966US9385560B2Methods, devices and systems for self charging sensorsQUALCOMM INC·Filed 2013·Granted Jul 5, 2016·2 cites·16 claims
- 2065US6001493ASubstrate for transferring bumps and method of useMOTOROLA INC·Filed 1998·Granted Dec 14, 1999·26 cites·15 claims
- 2164US10182710B2Wearable dual-ear mobile otoscopeQUALCOMM INC·Filed 2015·Granted Jan 22, 2019·1 cites·24 claims
- 2264US7176062B1Lead-frame method and assembly for interconnecting circuits within a circuit moduleAMKOR TECHNOLOGY INC·Filed 2005·Granted Feb 13, 2007·2 cites·20 claims
- 2362US8502373B23-D integrated circuit lateral heat dissipationKASKOUN KENNETH·Filed 2008·Granted Aug 6, 2013·2 cites·25 claims
- 2461US2010174661A1Wireless BrandingQUALCOMM INC·Filed 2009·Application pending·0 cites
- 2561US2020245941A1Method, devices and systems for sensor with removable nodesCAPSULE TECHNOLOGIES INC·Filed 2020·Application pending·0 cites
- 2659US11266351B2Method, devices and systems for sensor with removable nodesPHILIPS HEALTCHARE INFORMATICS INC·Filed 2019·Granted Mar 8, 2022·0 cites·18 claims
- 2758US6900527B1Lead-frame method and assembly for interconnecting circuits within a circuit moduleAMKOR TECHNOLOGY INC·Filed 2001·Granted May 31, 2005·6 cites·19 claims
- 2852US2014329192A1Electronically Enabled Removable Dental DeviceKASKOUN LUCIE R·Filed 2013·Application pending·0 cites
- 2951US9202705B1Integrated circuit module with lead frame micro-needlesQUALCOMM INC·Filed 2015·Granted Dec 1, 2015·0 cites·10 claims
- 3051US7019387B1Lead-frame connector and circuit module assemblyAMKOR TECHNOLOGY INC·Filed 2002·Granted Mar 28, 2006·4 cites·22 claims
- 3149US8847360B2Systems and methods for enabling ESD protection on 3-D stacked devicesKASKOUN KENNETH·Filed 2011·Granted Sep 30, 2014·0 cites·18 claims
- 3249US8076768B2IC interconnectKASKOUN KENNETH·Filed 2010·Granted Dec 13, 2011·0 cites·12 claims
- 3348US9478528B2Devices, systems and methods using through silicon optical interconnectsQUALCOMM INC·Filed 2013·Granted Oct 25, 2016·0 cites·65 claims
- 3447US2010127937A1Antenna Integrated in a Semiconductor ChipQUALCOMM INC·Filed 2008·Application pending·0 cites
- 3545US8717057B2Integrated tester chip using die packaging technologiesKASKOUN KENNETH·Filed 2008·Granted May 6, 2014·0 cites·6 claims
- 3645US2010155931A1Embedded Through Silicon Stack 3-D Die In A Package SubstrateQUALCOMM INC·Filed 2008·Application pending·0 cites
- 3744US9572532B2Button sensorMATSUMORI BARRY ALAN·Filed 2009·Granted Feb 21, 2017·0 cites·20 claims
- 3843US2014044307A1Sensor input recording and translation into human linguistic formKENAGY JASON B·Filed 2012·Application pending·0 cites
- 3941US2009322366A1Integrated Tester Chip Using Die Packaging TechnologiesQUALCOMM INC·Filed 2008·Application pending·0 cites
- 4037US2003184978A1Circuit module assembly having an edge-attached vented cover and method for edge-attachingFiled 2001·Application pending·0 cites
- 4134US8258613B1Semiconductor memory cardDICAPRIO VINCENT·Filed 2003·Granted Sep 4, 2012·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →