Inventor · disambiguated record
Ken Lam
Also filed as: LAM KEN · LAM KEN M
59 granted patents·6 pending applications·2,460 citations·filing 1985–2024
99Inventor score
Top patents by PatentIndex Score
65 records- 0199US9532722B2Patient monitoring systemLAMEGO MARCELO·Filed 2012·Granted Jan 3, 2017·633 cites·28 claims
- 0298US6281046B1Method of forming an integrated circuit package at a wafer levelATMEL CORP·Filed 2000·Granted Aug 28, 2001·191 cites·19 claims
- 0397US9649054B2Blood pressure measurement methodLAMEGO MARCELO·Filed 2011·Granted May 16, 2017·597 cites·7 claims
- 0497US8018065B2Wafer-level integrated circuit package with top and bottom side electrical connectionsATMEL CORP·Filed 2008·Granted Sep 13, 2011·57 cites·7 claims
- 0597US6344401B1Method of forming a stacked-die integrated circuit chip package on a water levelATMEL CORP·Filed 2000·Granted Feb 5, 2002·159 cites·18 claims
- 0696US7880193B2Method for forming an integral electromagnetic radiation shield in an electronic packageATMEL CORP·Filed 2009·Granted Feb 1, 2011·37 cites·19 claims
- 0795US11925445B2Patient monitoring systemMASIMO CORP·Filed 2022·Granted Mar 12, 2024·2 cites·17 claims
- 0895US9704812B1Double-sided electronic packageATMEL CORP·Filed 2016·Granted Jul 11, 2017·12 cites·20 claims
- 0993US7564137B2Stackable integrated circuit structures and systems devices and methods related theretoATMEL CORP·Filed 2006·Granted Jul 21, 2009·22 cites·23 claims
- 1091US6511901B1Metal redistribution layer having solderable pads and wire bondable padsATMEL CORP·Filed 1999·Granted Jan 28, 2003·107 cites·11 claims
- 1190US7932590B2Stacked-die electronics package with planar and three-dimensional inductor elementsATMEL CORP·Filed 2006·Granted Apr 26, 2011·18 cites·13 claims
- 1289US7342308B2Component stacking for integrated circuit electronic packageATMEL CORP·Filed 2005·Granted Mar 11, 2008·14 cites·28 claims
- 1388US6577008B2Metal redistribution layer having solderable pads and wire bondable padsATMEL CORP·Filed 2001·Granted Jun 10, 2003·41 cites·7 claims
- 1488US6541284B2Integrated IC chip package for electronic image sensor dieATMEL CORP·Filed 2001·Granted Apr 1, 2003·52 cites·18 claims
- 1587US7239976B2Method and system for automatic pointing stabilization and aiming control deviceAMERICAN GNC CORP·Filed 2006·Granted Jul 3, 2007·20 cites·24 claims
- 1687US6762117B2Method of fabricating metal redistribution layer having solderable pads and wire bondable padsATMEL CORP·Filed 2003·Granted Jul 13, 2004·37 cites·5 claims
- 1786US6376914B2Dual-die integrated circuit packageATMEL CORP·Filed 1999·Granted Apr 23, 2002·86 cites·23 claims
- 1884US11272852B2Patient monitoring systemMASIMO CORP·Filed 2016·Granted Mar 15, 2022·4 cites·15 claims
- 1984US7239975B2Method and system for automatic stabilization and pointing control of a deviceAMERICAN GNC CORP·Filed 2005·Granted Jul 3, 2007·21 cites·18 claims
- 2083US12318175B2Patient monitoring systemMASIMO CORP·Filed 2024·Granted Jun 3, 2025·0 cites·20 claims
- 2177US8455304B2Routable array metal integrated circuit package fabricated using partial etching processLAM KEN·Filed 2010·Granted Jun 4, 2013·4 cites·20 claims
- 2277US7816769B2Stackable packages for three-dimensional packaging of semiconductor diceATMEL CORP·Filed 2006·Granted Oct 19, 2010·6 cites·14 claims
- 2377US6388335B1Integrated circuit package formed at a wafer levelATMEL CORP·Filed 1999·Granted May 14, 2002·43 cites·8 claims
- 2476US5216806AMethod of forming a chip package and package interconnectsATMEL CORP·Filed 1992·Granted Jun 8, 1993·53 cites·22 claims
- 2575US5367763ATAB testing of area array interconnected chipsATMEL CORP·Filed 1993·Granted Nov 29, 1994·44 cites·18 claims
- 2675US5177863AMethod of forming integrated leadouts for a chip carrierATMEL CORP·Filed 1992·Granted Jan 12, 1993·52 cites·17 claims
- 2774US7327030B2Apparatus and method incorporating discrete passive components in an electronic packageATMEL CORP·Filed 2005·Granted Feb 5, 2008·4 cites·26 claims
- 2872US7626247B2Electronic package with integral electromagnetic radiation shield and methods related theretoATMEL CORP·Filed 2005·Granted Dec 1, 2009·4 cites·23 claims
- 2970US7323765B2Die attach paddle for mounting integrated circuit dieATMEL CORP·Filed 2004·Granted Jan 29, 2008·12 cites·5 claims
- 3070US7271031B2Universal interconnect dieATMEL CORP·Filed 2006·Granted Sep 18, 2007·4 cites·4 claims
- 3169US8258599B2Electronics package with an integrated circuit device having post wafer fabrication integrated passive componentsLAM KEN M·Filed 2006·Granted Sep 4, 2012·4 cites·8 claims
- 3269US7981796B2Methods for forming packaged productsATMEL CORP·Filed 2010·Granted Jul 19, 2011·2 cites·18 claims
- 3368US8324023B2Stacked-die electronics package with planar and three-dimensional inductor elementsLAM KEN·Filed 2011·Granted Dec 4, 2012·2 cites·17 claims
- 3467US7638862B2Die attach paddle for mounting integrated circuit dieATMEL CORP·Filed 2007·Granted Dec 29, 2009·2 cites·14 claims
- 3567US6413799B1Method of forming a ball-grid array package at a wafer levelATMEL CORP·Filed 2000·Granted Jul 2, 2002·12 cites·14 claims
- 3666US8044526B2Integrated circuit assemblies with alignment features and devices and methods related theretoATMEL CORP·Filed 2010·Granted Oct 25, 2011·1 cites·18 claims
- 3766US7821122B2Method and system for increasing circuitry interconnection and component capacity in a multi-component packageATMEL CORP·Filed 2005·Granted Oct 26, 2010·3 cites·36 claims
- 3865US7927918B2Packaged products, including stacked package modules, and methods of forming sameATMEL CORP·Filed 2009·Granted Apr 19, 2011·2 cites·21 claims
- 3964US7838971B2Method to provide substrate-ground coupling for semiconductor integrated circuit dice constructed from SOI and related materials in stacked-die packagesATMEL CORP·Filed 2006·Granted Nov 23, 2010·2 cites·11 claims
- 4064US7078792B2Universal interconnect dieATMEL CORP·Filed 2004·Granted Jul 18, 2006·10 cites·40 claims
- 4164US5249728ABumpless bonding process having multilayer metallizationATMEL CORP·Filed 1993·Granted Oct 5, 1993·40 cites·17 claims
- 4262US8487424B2Routable array metal integrated circuit package fabricated using partial etching processLAM KEN·Filed 2012·Granted Jul 16, 2013·1 cites·6 claims
- 4361US4612227APressure sensor headerHONEYWELL INC·Filed 1985·Granted Sep 16, 1986·20 cites·7 claims
- 4460US8860195B2Apparatus and method for increasing the quantity of discrete electronic components in an integrated circuit packageLAM KEN M·Filed 2009·Granted Oct 14, 2014·1 cites·13 claims
- 4558US8174099B2Leadless package with internally extended package leadsLAM KEN·Filed 2008·Granted May 8, 2012·1 cites·9 claims
- 4654US8568822B2Apparatus and method incorporating discrete passive components in an electronic packageLAM KEN M·Filed 2007·Granted Oct 29, 2013·0 cites·12 claims
- 4754US7678618B2Methods using die attach paddle for mounting integrated circuit dieATMEL CORP·Filed 2007·Granted Mar 16, 2010·0 cites·22 claims
- 4854US6972486B2Low profile carrier for non-wafer form device testingATMEL CORP·Filed 2003·Granted Dec 6, 2005·4 cites·14 claims
- 4953US8525329B2Component stacking for integrated circuit electronic packageLAM KEN M·Filed 2012·Granted Sep 3, 2013·0 cites·13 claims
- 5053US8237266B2Component stacking for integrated circuit electronic packageLAM KEN·Filed 2008·Granted Aug 7, 2012·0 cites·16 claims
Showing the top 50 of 65 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →