Inventor · disambiguated record
Kevin Lee
Also filed as: LEE KEVIN · LEE KEVIN C · LEE KEVIN J
14 granted patents·2 pending applications·518 citations·filing 1988–2025
94Inventor score
Files withCISCO TECH INC5ADDEPALLI SATEESH K2CORNELL RES FOUNDATION INC2TAIWAN SEMICONDUCTOR MFG CO LTD2UNITED MICROELECTRONICS CORP2
Top patents by PatentIndex Score
16 records- 0198US9654937B2System and method for routing, mobility, application services, discovery, and sensing in a vehicular network environmentCISCO TECH INC·Filed 2015·Granted May 16, 2017·16 cites·17 claims
- 0298US9036509B1System and method for routing, mobility, application services, discovery, and sensing in a vehicular network environmentADDEPALLI SATEESH K·Filed 2011·Granted May 19, 2015·212 cites·13 claims
- 0398US8718055B2Fast-tracking approach for building routing topologies in fast-moving networksVASSEUR JEAN-PHILIPPE·Filed 2012·Granted May 6, 2014·118 cites·24 claims
- 0494US8761285B2Application-aware dynamic bit-level error protection for modulation-based communicationADDEPALLI SATEESH K·Filed 2012·Granted Jun 24, 2014·21 cites·21 claims
- 0593US9037896B2Root cause analysis in a sensor-actuator fabric of a connected environmentCISCO TECH INC·Filed 2012·Granted May 19, 2015·20 cites·20 claims
- 0691US9628582B2Social-driven precaching of accessible objectsCISCO TECH INC·Filed 2016·Granted Apr 18, 2017·6 cites·20 claims
- 0791US7663234B2Package of a semiconductor device with a flexible wiring substrate and method for the sameUNITED MICROELECTRONICS CORP·Filed 2006·Granted Feb 16, 2010·24 cites·8 claims
- 0886US12417945B2Contact features of semiconductor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 16, 2025·1 cites·20 claims
- 0985US9344515B2Social-driven precaching of accessible objectsCISCO TECH INC·Filed 2013·Granted May 17, 2016·5 cites·20 claims
- 1084US4952446AUltra-thin semiconductor membranesCORNELL RES FOUNDATION INC·Filed 1988·Granted Aug 28, 1990·74 cites·8 claims
- 1176US9444598B2Application-aware dynamic bit-level error protection for modulation-based communicationCISCO TECH INC·Filed 2014·Granted Sep 13, 2016·3 cites·21 claims
- 1275US7303400B2Package of a semiconductor device with a flexible wiring substrate and method for the sameUNITED MICROELECTRONICS CORP·Filed 2005·Granted Dec 4, 2007·6 cites·12 claims
- 1374US2025316536A1Contact features of semiconductor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1446US2006012039A1Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flowKIM SARAH E·Filed 2005·Application pending·0 cites
- 1545US12364060B2Bottom tunnel junction light-emitting field-effect transistorsUNIV CORNELL·Filed 2021·Granted Jul 15, 2025·0 cites·19 claims
- 1642US4946735AUltra-thin semiconductor membranesCORNELL RES FOUNDATION INC·Filed 1988·Granted Aug 7, 1990·12 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →