Inventor · disambiguated record
Keng-Jen Lin
Also filed as: LIN KENG J · LIN KENG-JEN
16 granted patents·1 pending application·360 citations·filing 2010–2020
92Inventor score
Top patents by PatentIndex Score
17 records- 0197US9847247B2Method for filling gaps of semiconductor device and semiconductor device formed by the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Dec 19, 2017·284 cites·13 claims
- 0295US9793174B1FinFET device on silicon-on-insulator and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Oct 17, 2017·22 cites·17 claims
- 0394US9418853B1Method for forming a stacked layer structureUNITED MICROELECTRONICS CORP·Filed 2015·Granted Aug 16, 2016·21 cites·14 claims
- 0489US9356125B1Manufacturing method of semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2015·Granted May 31, 2016·7 cites·15 claims
- 0589US9130014B2Method for fabricating shallow trench isolation structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted Sep 8, 2015·8 cites·7 claims
- 0688US9685319B2Method for filling gaps of semiconductor device and semiconductor device formed by the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jun 20, 2017·5 cites·7 claims
- 0776US10347640B1Method for forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jul 9, 2019·4 cites·15 claims
- 0876US9117878B2Method for manufacturing shallow trench isolationUNITED MICROELECTRONICS CORP·Filed 2012·Granted Aug 25, 2015·3 cites·19 claims
- 0975US10366991B1Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jul 30, 2019·2 cites·22 claims
- 1075US9543408B1Method of forming patterned hard mask layerUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jan 10, 2017·2 cites·12 claims
- 1165US9570578B2Gate and gate forming processUNITED MICROELECTRONICS CORP·Filed 2015·Granted Feb 14, 2017·1 cites·12 claims
- 1258US11990547B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted May 21, 2024·0 cites·5 claims
- 1355US8513519B2Use of exfoliated clay nanoplatelets and method for encapsulating cationsLIN KING-FU·Filed 2010·Granted Aug 20, 2013·1 cites·14 claims
- 1446US10460925B2Method for processing semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Oct 29, 2019·0 cites·20 claims
- 1544US10043888B2Method for forming a semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 7, 2018·0 cites·13 claims
- 1641US2014213034A1Method for forming isolation structureUNITED MICROELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 1739US8293034B2Lead-free brass alloyWU WEI TE·Filed 2010·Granted Oct 23, 2012·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →