Inventor · disambiguated record
Kenji Masumoto
Also filed as: MASUMOTO KENJI · MASUMOTO MUTSUMI
24 granted patents·7 pending applications·615 citations·filing 1990–2014
97Inventor score
Files withTEXAS INSTRUMENTS INC20MASUMOTO KENJI4GALLEGOS BERNARDO2TEXAS INSTRUMENTS JAPAN2FUJIKURA LTD1
Top patents by PatentIndex Score
31 records- 0192US8115310B2Copper pillar bonding for fine pitch flip chip devicesMASUMOTO KENJI·Filed 2009·Granted Feb 14, 2012·38 cites·18 claims
- 0291US6835595B1Semiconductor package, semiconductor device, electronic device, and method of manufacturing semiconductor packageFUJIKURA LTD·Filed 2000·Granted Dec 28, 2004·60 cites·8 claims
- 0391US6780749B2Method of manufacturing a semiconductor chip comprising multiple bonding pads in staggard rows on edgesTEXAS INSTRUMENTS INC·Filed 2003·Granted Aug 24, 2004·63 cites·16 claims
- 0491US6482730B1Method for manufacturing a semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2000·Granted Nov 19, 2002·67 cites·16 claims
- 0590US7023088B2Semiconductor package, semiconductor device and electronic deviceTEXAS INSTRUMENTS JAPAN·Filed 2003·Granted Apr 4, 2006·53 cites·9 claims
- 0689US6759745B2Semiconductor device and manufacturing method thereofTEXAS INSTRUMENTS INC·Filed 2002·Granted Jul 6, 2004·56 cites·22 claims
- 0787US7157363B2Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portionTEXAS INSTRUMENTS JAPAN·Filed 2004·Granted Jan 2, 2007·39 cites·11 claims
- 0886US6269999B1Semiconductor chip mounting method utilizing ultrasonic vibrationsTEXAS INSTRUMENTS INC·Filed 2000·Granted Aug 7, 2001·41 cites·15 claims
- 0984US7005719B2Integrated circuit structure having a flip-chip mounted photoreceiverTEXAS INSTRUMENTS INC·Filed 2004·Granted Feb 28, 2006·27 cites·27 claims
- 1078US6992380B2Package for semiconductor device having a device-supporting polymeric material covering a solder ball array areaTEXAS INSTRUMENTS INC·Filed 2003·Granted Jan 31, 2006·21 cites·16 claims
- 1176US8298874B2Packaged electronic devices having die attach regions with selective thin dielectric layerGALLEGOS BERNARDO·Filed 2012·Granted Oct 30, 2012·4 cites·14 claims
- 1276US6734532B2Back side coating of semiconductor wafersTEXAS INSTRUMENTS INC·Filed 2001·Granted May 11, 2004·22 cites·20 claims
- 1373US6583483B2Semiconductor device and its manufacturing methodTEXAS INSTRUMENTS INC·Filed 2001·Granted Jun 24, 2003·18 cites·18 claims
- 1471US6830956B2Method for packaging a low profile semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2002·Granted Dec 14, 2004·17 cites·14 claims
- 1566US5258331AMethod of manufacturing resin-encapsulated semiconductor device package using photoresist or pre-peg lead frame dam barsTEXAS INSTRUMENTS INC·Filed 1992·Granted Nov 2, 1993·38 cites·3 claims
- 1663US6525424B2Semiconductor device and its manufacturing methodTEXAS INSTRUMENTS INC·Filed 2001·Granted Feb 25, 2003·10 cites·20 claims
- 1762US8222748B2Packaged electronic devices having die attach regions with selective thin dielectric layerGALLEGOS BERNARDO·Filed 2009·Granted Jul 17, 2012·2 cites·10 claims
- 1856US6929971B2Semiconductor device and its manufacturing methodTEXAS INSTRUMENTS INC·Filed 2002·Granted Aug 16, 2005·7 cites·9 claims
- 1954US6875637B2Semiconductor package insulation film and manufacturing method thereofTEXAS INSTRUMENTS INC·Filed 2001·Granted Apr 5, 2005·6 cites·11 claims
- 2053US6894374B2Semiconductor package insulation film and manufacturing method thereofTEXAS INSTRUMENTS INC·Filed 2003·Granted May 17, 2005·5 cites·3 claims
- 2150US5176366AResin-encapsulated semiconductor device package with nonconductive tape embedded between outer lead portionsTEXAS INSTRUMENTS INC·Filed 1990·Granted Jan 5, 1993·19 cites·8 claims
- 2248US7344916B2Package for a semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2005·Granted Mar 18, 2008·0 cites·18 claims
- 2348US2009289360A1Workpiece contact pads with elevated ring for restricting horizontal movement of terminals of ic during pressingTEXAS INSTRUMENTS INC·Filed 2009·Application pending·0 cites
- 2447US6876077B2Semiconductor device and its manufacturing methodTEXAS INSTRUMENTS INC·Filed 2003·Granted Apr 5, 2005·2 cites·5 claims
- 2545US7679002B2Semiconductive device having improved copper density for package-on-package applicationsTEXAS INSTRUMENTS INC·Filed 2006·Granted Mar 16, 2010·0 cites·11 claims
- 2644US2011024899A1Substrate structure for cavity packageMASUMOTO KENJI·Filed 2009·Application pending·0 cites
- 2744US2010289138A1Substrate structure for flip-chip interconnect deviceMASUMOTO KENJI·Filed 2009·Application pending·0 cites
- 2843US2009108433A1Multilayer semiconductor device package assembly and methodMASUMOTO KENJI·Filed 2007·Application pending·0 cites
- 2942US2015008566A1Method and structure of panelized packaging of semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2014·Application pending·0 cites
- 3037US2003036257A1Semiconductor device manufacturing methodFiled 2002·Application pending·0 cites
- 3133US2012205354A1Reducing dross welding phenomenon during irradiation engraving of a metal sheetKUDOH TAKAHIKO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →