Inventor · disambiguated record
Kensuke Nagaoka
Also filed as: NAGAOKA KENSUKE
6 granted patents·13 citations·filing 2015–2021
74Inventor score
Technology areasH10P
Files withDISCO CORP6
Top patents by PatentIndex Score
6 records- 0187US9293372B2Wafer processing methodDISCO CORP·Filed 2015·Granted Mar 22, 2016·7 cites·2 claims
- 0278US9536787B2Wafer processing methodDISCO CORP·Filed 2016·Granted Jan 3, 2017·3 cites·3 claims
- 0377US11011406B2Method of processing a substrateDISCO CORP·Filed 2019·Granted May 18, 2021·2 cites·26 claims
- 0463US9716039B2Wafer processing methodDISCO CORP·Filed 2016·Granted Jul 25, 2017·1 cites·2 claims
- 0549US11842926B2Method of processing a substrateDISCO CORP·Filed 2021·Granted Dec 12, 2023·0 cites·13 claims
- 0632US9779993B2Wafer processing method including attaching a protective tape to a front side of a functional layer to prevent debris adhesionDISCO CORP·Filed 2015·Granted Oct 3, 2017·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →