Inventor · disambiguated record
Ken Nanaumi
Also filed as: NANAUMI KEN · SHINKO TOYOTARO
14 granted patents·1 pending application·158 citations·filing 1978–2009
92Inventor score
Top patents by PatentIndex Score
15 records- 0187US6475629B1Adhesive film formed of a siloxane-modified polyamideimide resin composition, adhesive sheet and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2001·Granted Nov 5, 2002·41 cites·9 claims
- 0278US8426985B2Positive-type photosensitive resin composition, method for producing resist pattern, and electronic componentMATSUTANI HIROSHI·Filed 2009·Granted Apr 23, 2013·9 cites·15 claims
- 0373US6252010B1Siloxane-modified polyamideimide resin composition, adhesive film, adhesive sheet and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 1998·Granted Jun 26, 2001·39 cites·26 claims
- 0470US8461699B2Positive-type photosensitive resin composition, method for producing resist pattern, semiconductor device, and electronic deviceMATSUTANI HIROSHI·Filed 2009·Granted Jun 11, 2013·3 cites·28 claims
- 0565US4278786AAromatic polyamides containing ether linkages and process for producing sameHITACHI LTD·Filed 1979·Granted Jul 14, 1981·14 cites·14 claims
- 0659US5206333AMethod of producing a naphthol-modified phenolic resin of highly increased molecular weightHITACHI CHEMICAL CO LTD·Filed 1992·Granted Apr 27, 1993·13 cites·17 claims
- 0758US7538150B2Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resinHITACHI CHEMICAL CO LTD·Filed 2005·Granted May 26, 2009·0 cites·26 claims
- 0853US9786576B2Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic deviceMATSUTANI HIROSHI·Filed 2008·Granted Oct 10, 2017·1 cites·11 claims
- 0950US5380789AMethod of preparing vegetable oil-modified phenolic resin and laminate produced by using the sameHITACHI CHEMICAL CO LTD·Filed 1993·Granted Jan 10, 1995·8 cites·15 claims
- 1048US8084130B2Epoxy resin molding material for sealing and electronic component deviceHAMADA MITSUYOSHI·Filed 2007·Granted Dec 27, 2011·2 cites·14 claims
- 1147US2004076805A1Thermosetting resin composition, and prepreg, laminate for circuit board, and printed circuit board each made therewithFiled 2002·Application pending·0 cites
- 1246US5885723ABonding film for printed circuit boardsHITACHI CHEMICAL CO LTD·Filed 1997·Granted Mar 23, 1999·12 cites·12 claims
- 1340US4209429AProcess for producing internally plasticized phenolic resinsHITACHI CHEMICAL CO LTD·Filed 1978·Granted Jun 24, 1980·7 cites·24 claims
- 1432US5066691AAdhesive composition for metal-clad laminatesHITACHI CHEMICAL CO LTD·Filed 1989·Granted Nov 19, 1991·8 cites·4 claims
- 1528US4229330AProcess for producing phenolic resinsHITACHI CHEMICAL CO LTD·Filed 1978·Granted Oct 21, 1980·1 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →