Inventor · disambiguated record
Keigo Nishida
Also filed as: NISHIDA KEIGO
8 granted patents·14 pending applications·20 citations·filing 1996–2024
79Inventor score
Files withKOKUSAI ELECTRIC CORP13HITACHI INT ELECTRIC INC3NICHIA CORP2KANEGAFUCHI CHEMICAL IND1MITSUBISHI HITACHI POWER SYS1
Top patents by PatentIndex Score
22 records- 0188US11594412B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Feb 28, 2023·2 cites·14 claims
- 0281US11965240B2Cleaning method, method of manufacturing semiconductor device, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2021·Granted Apr 23, 2024·1 cites·15 claims
- 0380US2025125143A1Method of manufacturing semiconductor device capable of controlling film thickness distributionKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0480US2025118549A1Method of manufacturing semiconductor device capable of controlling film thickness distributionKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0571US2024035155A1Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 0670US12211689B2Method of manufacturing semiconductor device capable of controlling film thickness distributionKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jan 28, 2025·0 cites·18 claims
- 0768US2023170212A1Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 0866US2025115993A1Substrate processing apparatus, cleaning method, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0965US11827979B2Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Nov 28, 2023·0 cites·21 claims
- 1064US9666430B2Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted May 30, 2017·1 cites·13 claims
- 1158US2024318306A1Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1256US2023360904A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1353US2023215724A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1452US2024321596A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1549US2023151273A1Light emitting device and lightening fixture provided with sameNICHIA CORP·Filed 2021·Application pending·0 cites
- 1648US2013149846A1Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2013·Application pending·0 cites
- 1743US6194665B1Film distinguished in coriona resistant characteristic and insulated wires, coils and motors comprising the film as an insulation materialKANEGAFUCHI CHEMICAL IND·Filed 1996·Granted Feb 27, 2001·16 cites·22 claims
- 1842US2009203749A1Agent for control of degranulation reaction and cytokine productionRIKEN·Filed 2006·Application pending·0 cites
- 1939US10190827B2Condenser and turbine equipmentMITSUBISHI HITACHI POWER SYS·Filed 2015·Granted Jan 29, 2019·0 cites·2 claims
- 2039US2012097287A1Duct arrangement, duct equipment, duct reinforcement construction method, support reinforcement structure, and reinforcement structure for support fixing unitSHIMIZU HIROSHI·Filed 2010·Application pending·0 cites
- 2137US2011207302A1Semiconductor device manufacturing method, and substrate processing method and apparatusHITACHI INT ELECTRIC INC·Filed 2011·Application pending·0 cites
- 2235US10763410B2Light emitting deviceNICHIA CORP·Filed 2017·Granted Sep 1, 2020·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →