Inventor · disambiguated record
Kei Nozawa
Also filed as: NOZAWA KEI
6 granted patents·70 citations·filing 2014–2022
83Inventor score
Top patents by PatentIndex Score
6 records- 0195US10879264B1Three-dimensional memory device containing through-array contact via structures between dielectric barrier walls and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Dec 29, 2020·20 cites·20 claims
- 0295US10872857B1Three-dimensional memory device containing through-array contact via structures between dielectric barrier walls and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Dec 22, 2020·17 cites·20 claims
- 0394US10957706B2Multi-tier three-dimensional memory device with dielectric support pillars and methods for making the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Mar 23, 2021·11 cites·13 claims
- 0492US10971514B2Multi-tier three-dimensional memory device with dielectric support pillars and methods for making the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Apr 6, 2021·8 cites·13 claims
- 0590US9397115B1Methods for making a trim-rate tolerant self-aligned contact via structure arraySANDISK TECHNOLOGIES INC·Filed 2014·Granted Jul 19, 2016·14 cites·33 claims
- 0650US12513902B2Three-dimensional memory device containing bridges for enhanced structural support and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →