Inventor · disambiguated record
Kentaro Odanaka
Also filed as: ODANAKA KENTARO
23 granted patents·6 pending applications·58 citations·filing 2004–2023
92Inventor score
Files withDISCO CORP29
Top patents by PatentIndex Score
29 records- 0189US9724783B2Laser processing apparatusDISCO CORP·Filed 2015·Granted Aug 8, 2017·10 cites·3 claims
- 0286US11393709B2Processing apparatus and workpiece processing methodDISCO CORP·Filed 2020·Granted Jul 19, 2022·2 cites·20 claims
- 0386US7326878B2Laser beam processing machineDISCO CORP·Filed 2006·Granted Feb 5, 2008·11 cites·3 claims
- 0483US9870961B2Wafer processing methodDISCO CORP·Filed 2016·Granted Jan 16, 2018·5 cites·1 claims
- 0576US6939785B2Process for manufacturing a semiconductor chipDISCO CORP·Filed 2004·Granted Sep 6, 2005·25 cites·5 claims
- 0674US10784166B2Wafer processing methodDISCO CORP·Filed 2019·Granted Sep 22, 2020·2 cites·4 claims
- 0769US12337412B2Laser processing apparatus and laser processing methodDISCO CORP·Filed 2023·Granted Jun 24, 2025·0 cites·6 claims
- 0868US10807198B2Laser processing apparatusDISCO CORP·Filed 2018·Granted Oct 20, 2020·1 cites·2 claims
- 0967US12343812B2Laser processing apparatusDISCO CORP·Filed 2023·Granted Jul 1, 2025·0 cites·4 claims
- 1067US12183635B2Wafer processing method and wafer processing apparatusDISCO CORP·Filed 2022·Granted Dec 31, 2024·0 cites·6 claims
- 1167US10668569B2Laser processing apparatusDISCO CORP·Filed 2016·Granted Jun 2, 2020·1 cites·8 claims
- 1267US2024123546A1Laser processing apparatus and laser processing methodDISCO CORP·Filed 2023·Application pending·0 cites
- 1365US9421643B2Laser processing apparatusDISCO CORP·Filed 2014·Granted Aug 23, 2016·1 cites·2 claims
- 1464US12148649B2Processing apparatus and workpiece processing methodDISCO CORP·Filed 2022·Granted Nov 19, 2024·0 cites·18 claims
- 1557US11515210B2Wafer processing method and wafer processing apparatusDISCO CORP·Filed 2020·Granted Nov 29, 2022·0 cites·10 claims
- 1656US12489019B2Method of processing wafer and laser applying apparatusDISCO CORP·Filed 2023·Granted Dec 2, 2025·0 cites·4 claims
- 1755US2023369116A1Manufacturing method of chipsDISCO CORP·Filed 2023·Application pending·0 cites
- 1853US12191216B2Laser processing apparatus and method of correcting converged spot positionDISCO CORP·Filed 2021·Granted Jan 7, 2025·0 cites·6 claims
- 1952US2023260854A1Wafer processing methodDISCO CORP·Filed 2023·Application pending·0 cites
- 2050US2022399235A1Manufacturing method for device chipDISCO CORP·Filed 2022·Application pending·0 cites
- 2143US10991622B2Wafer processing methodDISCO CORP·Filed 2019·Granted Apr 27, 2021·0 cites·7 claims
- 2242US2014206177A1Wafer processing methodDISCO CORP·Filed 2014·Application pending·0 cites
- 2341US10991623B2Wafer processing methodDISCO CORP·Filed 2019·Granted Apr 27, 2021·0 cites·3 claims
- 2441US10955290B2Laser processing apparatus and output power checking methodDISCO CORP·Filed 2018·Granted Mar 23, 2021·0 cites·8 claims
- 2537US2018211852A1Laser processing apparatusDISCO CORP·Filed 2018·Application pending·0 cites
- 2635US10354919B2Wafer dividing methodDISCO CORP·Filed 2016·Granted Jul 16, 2019·0 cites·3 claims
- 2735US9976951B2Protective film detecting methodDISCO CORP·Filed 2016·Granted May 22, 2018·0 cites·7 claims
- 2835US9613415B2Protective film detecting apparatus and protective film detecting methodDISCO CORP·Filed 2015·Granted Apr 4, 2017·0 cites·4 claims
- 2932US10207362B2Laser processing apparatusDISCO CORP·Filed 2016·Granted Feb 19, 2019·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →