Inventor · disambiguated record
Keishi Okamoto
Also filed as: OKAMOTO KEISHI
33 granted patents·6 pending applications·236 citations·filing 1994–2021
96Inventor score
Files withIBM21MATSUSHITA ELECTRIC INDUSTRIAL CO LTD3ABE YOSHINORI2TOYO ADVANCED TECH CO2BULDON CO LTD1
Top patents by PatentIndex Score
39 records- 0191US9354408B2Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguideIBM·Filed 2013·Granted May 31, 2016·12 cites·5 claims
- 0289US11264314B2Interconnection with side connection to substrateIBM·Filed 2019·Granted Mar 1, 2022·6 cites·9 claims
- 0389US9219041B2Electronic package for millimeter wave semiconductor diesELAD DANNY·Filed 2012·Granted Dec 22, 2015·13 cites·15 claims
- 0487USD647102SGraphical user interface for a computer monitor of an X-ray tomography scannerHITACHI MEDICAL CORP·Filed 2009·Granted Oct 18, 2011·39 cites·1 claims
- 0587US6847685B1Shuffling device, coding device, decoding device of video signal and medium recording the programs of shuffling, coding and decodingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Jan 25, 2005·35 cites·28 claims
- 0684US11114308B2Controlling of height of high-density interconnection structure on substrateIBM·Filed 2018·Granted Sep 7, 2021·3 cites·24 claims
- 0784US11004819B2Prevention of bridging between solder jointsIBM·Filed 2019·Granted May 11, 2021·3 cites·14 claims
- 0883US10622311B2High-density interconnecting adhesive tapeIBM·Filed 2017·Granted Apr 14, 2020·3 cites·16 claims
- 0982US10529665B2High-density interconnecting adhesive tapeIBM·Filed 2017·Granted Jan 7, 2020·3 cites·12 claims
- 1080US5625461ARecording and reproducing apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Apr 29, 1997·29 cites·1 claims
- 1179US10595399B2Method of reducing warpage of an organic substrateIBM·Filed 2018·Granted Mar 17, 2020·2 cites·8 claims
- 1278US9772462B2Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguideIBM·Filed 2016·Granted Sep 26, 2017·2 cites·10 claims
- 1376US9684237B2Circuit board formation using organic substratesIBM·Filed 2015·Granted Jun 20, 2017·2 cites·3 claims
- 1473US7931934B2Medical device having diamond-like thin film and method for manufacturing thereofTOYO ADVANCED TECH CO·Filed 2007·Granted Apr 26, 2011·11 cites·29 claims
- 1572US8756549B2Integrated circuit chip incorporating embedded thermal radiators for localized, on-demand, heating and a system and method for designing such an integrated circuit chipGRAF RICHARD S·Filed 2011·Granted Jun 17, 2014·6 cites·14 claims
- 1672US7813620B2Recording apparatus, editing apparatus, digital video recording system, and file formatPANASONIC CORP·Filed 2005·Granted Oct 12, 2010·2 cites·7 claims
- 1772US5923813AApparatus and method for image coding and recording/reproducingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Jul 13, 1999·46 cites·20 claims
- 1871US9893031B2Chip mounting structureIBM·Filed 2016·Granted Feb 13, 2018·1 cites·4 claims
- 1971US8435287B2Stent and method for fabricating the sameNAKATANI TATSUYUKI·Filed 2007·Granted May 7, 2013·4 cites·14 claims
- 2068US12087596B2Controlling of height of high-density interconnection structure on substrateIBM·Filed 2021·Granted Sep 10, 2024·0 cites·18 claims
- 2167US11456269B2Prevention of bridging between solder jointsIBM·Filed 2021·Granted Sep 27, 2022·0 cites·8 claims
- 2265US9138507B2Method for manufacturing an implant materialTOYO ADVANCED TECH CO·Filed 2014·Granted Sep 22, 2015·0 cites·5 claims
- 2363US10643910B2Fabrication of a sacrificial interposer test structureIBM·Filed 2018·Granted May 5, 2020·0 cites·20 claims
- 2460US10109540B2Fabrication of sacrificial interposer test structureIBM·Filed 2016·Granted Oct 23, 2018·0 cites·20 claims
- 2560USD456473SHead cover for a golf clubBULDON CO LTD·Filed 2001·Granted Apr 30, 2002·13 cites·1 claims
- 2658US10141278B2Chip mounting structureIBM·Filed 2017·Granted Nov 27, 2018·0 cites·7 claims
- 2757US2011318714A1Implant material and method for manufacturing the sameNIKAWA HIROKI·Filed 2009·Application pending·0 cites
- 2856US8221823B2Method for fabricating materialABE YOSHINORI·Filed 2010·Granted Jul 17, 2012·1 cites·15 claims
- 2953US9967971B2Method of reducing warpage of an orgacnic substrateIBM·Filed 2015·Granted May 8, 2018·0 cites·7 claims
- 3053US2010247917A1Carbon thin film and method of forming the sameNITTA YUKI·Filed 2008·Application pending·0 cites
- 3152US9760002B2Circuit board formation using organic substratesIBM·Filed 2015·Granted Sep 12, 2017·0 cites·7 claims
- 3251US10090586B2Wireless communication device with joined semiconductorsIBM·Filed 2017·Granted Oct 2, 2018·0 cites·18 claims
- 3350US2007207321A1Method For Treating Surface Of Material, Surface-Treated Material, Medical Material, And Medical InstrumentABE YOSHINORI·Filed 2005·Application pending·0 cites
- 3448US9780442B2Wireless communication device with joined semiconductorsIBM·Filed 2015·Granted Oct 3, 2017·0 cites·8 claims
- 3543US9941230B2Electrical connecting structure between a substrate and a semiconductor chipIBM·Filed 2015·Granted Apr 10, 2018·0 cites·15 claims
- 3642US2013275096A1Solder Joint Fatigue Life Prediction MethodIBM·Filed 2013·Application pending·0 cites
- 3740US9163149B2Implant materialMOCHIZUKI AKIRA·Filed 2011·Granted Oct 20, 2015·0 cites·8 claims
- 3839US2006209196A1Camera recorder and data recording mediumOHTSUKA TAKESHI·Filed 2003·Application pending·0 cites
- 3936US2010268897A1Memory device and memory device controllerOKAMOTO KEISHI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →