Inventor · disambiguated record
Keiichi Okawa
Also filed as: OKAWA KEIICHI
11 granted patents·2 pending applications·116 citations·filing 2006–2013
90Inventor score
Technology areasH10W
Top patents by PatentIndex Score
13 records- 0196US7679173B2Semiconductor device including a DC-DC converterRENESAS TECH CORP·Filed 2007·Granted Mar 16, 2010·37 cites·10 claims
- 0291US7220617B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted May 22, 2007·21 cites·11 claims
- 0389US8237232B2Semiconductor device including a DC-DC converter having a metal plateUNO TOMOAKI·Filed 2011·Granted Aug 7, 2012·9 cites·19 claims
- 0486US7405469B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2007·Granted Jul 29, 2008·12 cites·10 claims
- 0586US7374965B2Manufacturing method of semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted May 20, 2008·14 cites·22 claims
- 0685US7932588B2Semiconductor device including a DC-DC converter having a metal plateRENESAS ELECTRONICS CORP·Filed 2010·Granted Apr 26, 2011·6 cites·8 claims
- 0781US8592914B2Semiconductor device and manufacturing method of the sameUNO TOMOAKI·Filed 2012·Granted Nov 26, 2013·4 cites·14 claims
- 0881US7462887B2Semiconductor connection componentRENESAS TECH CORP·Filed 2006·Granted Dec 9, 2008·8 cites·7 claims
- 0970US9177833B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2013·Granted Nov 3, 2015·3 cites·4 claims
- 1066US7968370B2Semiconductor connection componentRENESAS ELECTRONICS CORP·Filed 2008·Granted Jun 28, 2011·2 cites·7 claims
- 1151US2008268577A1Semiconductor device and method of manufacturing the sameKAGII HIDEMASA·Filed 2008·Application pending·0 cites
- 1249US2008220568A1Manufacturing method of semiconductor deviceMUTO AKIRA·Filed 2008·Application pending·0 cites
- 1348US8298859B2Semiconductor connection componentKOIKE NOBUYA·Filed 2011·Granted Oct 30, 2012·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →