Inventor · disambiguated record
Kevin C. Olson
Also filed as: OLSON KEVIN C
27 granted patents·8 pending applications·191 citations·filing 1999–2012
96Inventor score
Top patents by PatentIndex Score
35 records- 0196US7803415B2Methods for coating food cansPPG IND OHIO INC·Filed 2007·Granted Sep 28, 2010·20 cites·16 claims
- 0285US6590049B1Multi-functional initiators for atom transfer radical (Co)polymerizationPPG IND OHIO INC·Filed 2000·Granted Jul 8, 2003·23 cites·19 claims
- 0384US7745508B2Compositions and methods for coating food cansPPG IND OHIO INC·Filed 2002·Granted Jun 29, 2010·18 cites·25 claims
- 0484US6844504B2Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereofPPG IND OHIO INC·Filed 2002·Granted Jan 18, 2005·28 cites·7 claims
- 0578US7690103B2Method of forming a printed circuit board with improved via designPPG IND OHIO INC·Filed 2007·Granted Apr 6, 2010·6 cites·6 claims
- 0676US8629218B2Curable film-forming compositions containing ortho-hydroxyl aromatic functional acrylic polymersKANIA CHARLES M·Filed 2010·Granted Jan 14, 2014·3 cites·17 claims
- 0776US7666945B2Non-gelled curable compositions containing imide functional compositionsPPG IND OHIO INC·Filed 2007·Granted Feb 23, 2010·2 cites·16 claims
- 0873US8563648B2Coating composition comprising an alkoxysilane, a polysiloxane, and a plurality of particlesSCHMELTZER ROBERT·Filed 2009·Granted Oct 22, 2013·4 cites·13 claims
- 0972US6326420B1Pigment dispersions containing dispersants prepared by controlled radical polymerizationPPG IND OHIO INC·Filed 1999·Granted Dec 4, 2001·12 cites·26 claims
- 1068US7743494B2Process of fabricating a circuit boardPPG IND OHIO INC·Filed 2008·Granted Jun 29, 2010·4 cites·37 claims
- 1167US8008188B2Method of forming solid blind vias through the dielectric coating on high density interconnect substrate materialsPPG IND OHIO INC·Filed 2007·Granted Aug 30, 2011·2 cites·16 claims
- 1267US7679001B2Circuit board and method of manufacture thereofPPG IND OHIO INC·Filed 2006·Granted Mar 16, 2010·2 cites·5 claims
- 1367US7000313B2Process for fabricating circuit assemblies using electrodepositable dielectric coating compositionsPPG IND OHIO INC·Filed 2002·Granted Feb 21, 2006·12 cites·48 claims
- 1467US6951707B2Process for creating vias for circuit assembliesPPG IND OHIO INC·Filed 2002·Granted Oct 4, 2005·10 cites·57 claims
- 1565US7002081B2Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereofPPG IND OHIO INC·Filed 2004·Granted Feb 21, 2006·8 cites·3 claims
- 1664US8258411B2Printed circuit board with improved via designWANG ALAN E·Filed 2009·Granted Sep 4, 2012·3 cites·6 claims
- 1763US6713587B2Electrodepositable dielectric coating compositions and methods related theretoPPG IND OHIO INC·Filed 2002·Granted Mar 30, 2004·11 cites·60 claims
- 1862US7159308B2Method of making a circuit boardPPG IND OHIO INC·Filed 2005·Granted Jan 9, 2007·1 cites·15 claims
- 1961US6824959B2Process for creating holes in polymeric substratesPPG IND OHIO INC·Filed 2002·Granted Nov 30, 2004·8 cites·43 claims
- 2058US7294683B2Non-gelled curable compositions containing imide functional compoundsPPG IND OHIO INC·Filed 2004·Granted Nov 13, 2007·2 cites·12 claims
- 2158US6671950B2Multi-layer circuit assembly and process for preparing the samePPG IND OHIO INC·Filed 2001·Granted Jan 6, 2004·7 cites·26 claims
- 2257US8141245B2Method of forming a circuit board with improved via designOLSON KEVIN C·Filed 2008·Granted Mar 27, 2012·1 cites·11 claims
- 2354US2010222493A1Compositions and methods for coating food cansPPG IND OHIO INC·Filed 2010·Application pending·0 cites
- 2452US8409982B2Method of forming solid blind vias through the dielectric coating on high density interconnect (HDI) substrate materialsOLSON KEVIN C·Filed 2011·Granted Apr 2, 2013·0 cites·14 claims
- 2551US7485812B2Single or multi-layer printed circuit board with improved via designPPG IND OHIO INC·Filed 2004·Granted Feb 3, 2009·4 cites·7 claims
- 2646US8598467B2Multi-layer circuit assembly and process for preparing the sameOLSON KEVIN C·Filed 2011·Granted Dec 3, 2013·0 cites·16 claims
- 2746US8065795B2Multi-layer circuit assembly and process for preparing the sameOLSON KEVIN C·Filed 2007·Granted Nov 29, 2011·0 cites·7 claims
- 2844US2006213685A1Single or multi-layer printed circuit board with improved edge via designWANG ALAN E·Filed 2006·Application pending·0 cites
- 2944US2014072716A1Polyepoxide-polyacid coating compositions, related coating processes and coated substratesENDLISH MARK E·Filed 2012·Application pending·0 cites
- 3044US2006075633A1Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereofWANG ALAN E·Filed 2005·Application pending·0 cites
- 3143US2014072717A1Polyepoxide-polyacid coating compositions, related coating processes and coated substratesPPG IND OHIO INC·Filed 2012·Application pending·0 cites
- 3242US2008302564A1Circuit assembly including a metal core substrate and process for preparing the samePPG IND OHIO INC·Filed 2007·Application pending·0 cites
- 3338US7228623B2Process for fabricating a multi layer circuit assemblyPPG IND OHIO INC·Filed 2002·Granted Jun 12, 2007·0 cites·13 claims
- 3436US2002124398A1Multi-layer circuit assembly and process for preparing the sameFiled 2001·Application pending·0 cites
- 3536US2002127494A1Process for preparing a multi-layer circuit assemblyFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →