Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof

Abstract

A circuit board layer 2 in accordance with the present invention includes a conductive sheet 4 sandwiched between an insulating top layer 10 and an insulating bottom layer 14. The top and bottom layers 10 and 14 and the conductive sheet 4 define the circuit board layer 2 having an edge that includes an edge 20 of the conductive sheet 4. An insulating edge layer 18 covers substantially all of the edge 20 of the conductive sheet 4.

1 . A method of forming a circuit board comprising the steps of: 
 (a) providing a first conductive sheet;    (b) selectively removing one or more portions of the first conductive sheet to form a first panel having a first circuit board that is coupled to a disposable part of the first panel by at least one tab that extends from an edge of the first circuit board to an edge of the disposable part of the first panel;    (c) applying an insulating coating to the first circuit board so that at least each edge of the first circuit board is covered thereby; and    (d) separating the first circuit board from the disposable part in a manner whereupon at least part of the tab remains attached to the first circuit board and includes an exposed edge of the conductive sheet of the first circuit board.    
   
   
       2 . The method as set forth in  claim 1 , wherein step (c) further includes applying the insulating coating to the first circuit board so that at least each edge of the at least one tab is covered thereby.  
   
   
       3 . The method as set forth in  claim 1 , wherein the at least part of the tab terminates one of inside and outside a perimeter of the first circuit board.  
   
   
       4 . The method as set forth in  claim 1 , further including the steps of: 
 (e) providing a second conductive sheet;    (f) selectively removing one or more portions of the second conductive sheet to form a second panel having a second circuit board that is coupled to a disposable part of the second panel by at least one tab that extends from an edge of the second circuit board to an edge of the disposable part of the second panel;    (g) applying an insulating coating to the second circuit board so that at least each edge of the second circuit board is covered thereby;    (h) laminating the first and second circuit boards together; and    (i) separating the second circuit board from the disposable part of the second panel in a manner whereupon at least part of the tab remains attached to the second circuit board and includes an exposed edge of the conductive sheet of the second circuit board.    
   
   
       5 . The method as set forth in  claim 4 , wherein the at least part of each tab terminates inside a perimeter of the corresponding circuit board.  
   
   
       6 . The method as set forth in  claim 4 , wherein the at least part of each tab terminates outside a perimeter of the corresponding circuit board.  
   
   
       7 . The method as set forth in claim  25 , wherein the at least one tab of the first circuit board is offset from the at least one tab of the second circuit board.  
   
   
       8 . The method as set forth in  claim 6 , further including the step of electrically connecting an electrical component between the at least one tab of the first circuit board and the at least one tab of the second circuit board.