Inventor · disambiguated record
Kenta Ono
Also filed as: ONO KENTA
9 granted patents·19 pending applications·17 citations·filing 2011–2025
81Inventor score
Top patents by PatentIndex Score
28 records- 0192US11651971B2Etching method, substrate processing apparatus, and substrate processing systemTOKYO ELECTRON LTD·Filed 2021·Granted May 16, 2023·2 cites·21 claims
- 0288US8582277B2Laminated type ceramic electronic partsTANAKA HIROBUMI·Filed 2011·Granted Nov 12, 2013·10 cites·11 claims
- 0383US11355350B2Etching method, substrate processing apparatus, and substrate processing systemTOKYO ELECTRON LTD·Filed 2020·Granted Jun 7, 2022·1 cites·20 claims
- 0483US11328933B2Etching method, substrate processing apparatus, and substrate processing systemTOKYO ELECTRON LTD·Filed 2020·Granted May 10, 2022·1 cites·14 claims
- 0582US12112954B2Etching method, substrate processing apparatus, and substrate processing systemTOKYO ELECTRON LTD·Filed 2021·Granted Oct 8, 2024·1 cites·20 claims
- 0671US2025174466A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0771US2025164886A1Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0866US12456628B2Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2023·Granted Oct 28, 2025·0 cites·19 claims
- 0966US11865850B2Liquid ejecting apparatus and liquid ejecting headSEIKO EPSON CORP·Filed 2022·Granted Jan 9, 2024·0 cites·14 claims
- 1062US2025349519A1Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 1161US12412750B2Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Sep 9, 2025·0 cites·17 claims
- 1259US2025166976A1Dry-developing resist film formed of metal-containing resistTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 1358US8697546B2Method of manufacturing semiconductor deviceONO KENTA·Filed 2012·Granted Apr 15, 2014·2 cites·16 claims
- 1458US2025271735A1Image capturing apparatus that is improved in operability while reducing size of gripCANON KK·Filed 2025·Application pending·0 cites
- 1558US2025308926A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 1658US2024071772A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1757US2025264805A1Substrate processing method, composition for forming metal-containing resist, metal-containing resist, and substrate processing systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 1857US2024047223A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1956US2024006188A1Plasma processing method and plasma processing systemTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 2055US2023377899A1Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 2154US2025226222A1Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 2254US2025226223A1Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 2354US2025224683A1Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 2453US2025210328A1Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 2552US2022262645A1Etching method, substrate processing apparatus, and substrate processing systemTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 2652US2024250215A1Semiconductor element and production method thereforTDK CORP·Filed 2022·Application pending·0 cites
- 2752US2024250048A1Electronic componentTDK CORP·Filed 2022·Application pending·0 cites
- 2852US2025280489A1Electronic device for transferring heat from heating element to cooling ductCANON KK·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →