Inventor · disambiguated record
Keiya Saito
Also filed as: SAITO KEIYA
18 granted patents·1 pending application·558 citations·filing 1984–2011
96Inventor score
Top patents by PatentIndex Score
19 records- 0194US7119908B2Method and apparatus for measuring thickness of thin film and device manufacturing method using sameHITACHI LTD·Filed 2002·Granted Oct 10, 2006·62 cites·11 claims
- 0294US4983540AMethod of manufacturing devices having superlattice structuresHITACHI LTD·Filed 1988·Granted Jan 8, 1991·123 cites·27 claims
- 0394US4868068AIC wiring connecting method and resulting articleHITACHI LTD·Filed 1987·Granted Sep 19, 1989·59 cites·43 claims
- 0489US8045146B2Method and apparatus for reviewing defectHITACHI HIGH TECH CORP·Filed 2008·Granted Oct 25, 2011·18 cites·9 claims
- 0587US7599076B2Method for optically detecting height of a specimen and charged particle beam apparatus using the sameHITACHI HIGH TECH CORP·Filed 2006·Granted Oct 6, 2009·9 cites·9 claims
- 0686US4933565AMethod and apparatus for correcting defects of X-ray maskHITACHI LTD·Filed 1988·Granted Jun 12, 1990·43 cites·11 claims
- 0785US4925755AMethod of correcting defect in circuit patternHITACHI LTD·Filed 1988·Granted May 15, 1990·40 cites·6 claims
- 0877US4654583AMethod and apparatus for detecting defects of printed circuit patternsHITACHI LTD·Filed 1984·Granted Mar 31, 1987·32 cites·22 claims
- 0973US5113072ADevice having superlattice structure, and method of and apparatus for manufacturing the sameHITACHI LTD·Filed 1990·Granted May 12, 1992·48 cites·33 claims
- 1070US5497034AIC wiring connecting method and apparatusHITACHI LTD·Filed 1994·Granted Mar 5, 1996·22 cites·72 claims
- 1169US8411928B2Scatterometry method and device for inspecting patterned mediumSASAZAWA HIDEAKI·Filed 2009·Granted Apr 2, 2013·2 cites·11 claims
- 1269US8040772B2Method and apparatus for inspecting a pattern shapeHITACHI HIGH TECH CORP·Filed 2009·Granted Oct 18, 2011·1 cites·17 claims
- 1369US7057744B2Method and apparatus for measuring thickness of thin film and device manufacturing method using sameHITACHI LTD·Filed 2002·Granted Jun 6, 2006·13 cites·24 claims
- 1468US5472507AIC wiring connecting method and apparatusHITACHI LTD·Filed 1994·Granted Dec 5, 1995·19 cites·44 claims
- 1568US5116782AMethod and apparatus for processing a fine patternHITACHI LTD·Filed 1989·Granted May 26, 1992·34 cites·13 claims
- 1664US4700225AMethod and apparatus for testing pattern of a printed circuit boardHITACHI LTD·Filed 1986·Granted Oct 13, 1987·20 cites·5 claims
- 1757US8260029B2Pattern shape inspection method and apparatus thereofSAITO KEIYA·Filed 2009·Granted Sep 4, 2012·4 cites·14 claims
- 1851US5824598AIC wiring connecting method using focused energy beamsHITACHI LTD·Filed 1995·Granted Oct 20, 1998·9 cites·16 claims
- 1948US2012008132A1Method and apparatus for reviewing defectSAITO KEIYA·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →