Method and apparatus for reviewing defect

Abstract

The present invention provides an apparatus and a method for reviewing a defect with high throughput by detecting the defect to be reviewed with high sensitivity, comprising: an optical microscope; a correction means; and a scanning electron microscope which reviews the existing defect on the sample; wherein the optical microscope has: an optical height detection system which optically detects a vertical position of an upper surface of the sample placed on the stage; an illumination optical system which illuminates the defect with light; an image detection optical system which converges and detects reflected light or scattered light generated from the defect illuminated by the illumination optical system to obtain an image signal; and a focus adjusting means which adjusts a focus position of the optical microscope based on the vertical position of the upper surface of the sample, which is detected by the optical height detection system.

1 . An apparatus for reviewing a defect, comprising:
 a stage;   an optical microscope configured to optically re-detect an existing defect on a sample placed on the stage and configured to obtain position information of the existing defect on the sample; and   a scanning electron microscope configured to review the existing defect on the sample by positioning the existing defect on the sample within a visual field of the scanning electron microscope by moving the stage based on the position information of the existing defect by the optical microscope,   wherein the optical microscope includes:
 an illumination optical system configured to illuminate the existing defect on the sample with light; and 
 an image detecting optical system configured to converge and detect reflected light or scattered light generated from the existing defect on the sample illuminated by the illumination optical system, and to obtain an image signal, 
 wherein the image detection optical system determines a detection condition based on defect information detected by an external inspection apparatus. 
   
     
     
         2 . The apparatus according to  claim 1 ,
 wherein the optical microscope includes:   an optical height detection system configured to optically detect a vertical position of an upper surface of the sample placed on the stage.   
     
     
         3 . The apparatus according to  claim 2 , wherein the optical microscope includes:
 a focus adjusting means configured to adjust a focus position of the optical microscope based on the vertical position of the upper surface of the sample, the vertical position being detected by the optical height detection system.   
     
     
         4 . The apparatus according to  claim 2 , wherein
 the optical height detection system of the optical microscope is configured to project slit light on the sample through an objective lens provided for the optical microscope, to detect slit reflection light reflected from the sample due to the projection of the slit light by an optical sensor through the objective lens, and to detect a vertical position of the upper surface of the sample based on position of the slit reflection light detected by the optical sensor.   
     
     
         5 . The apparatus according to  claim 1 , wherein
 the illumination optical system of the optical microscope includes a dark field illumination optical system configured to illuminate the existing defect on the sample with the light from a direction that inclines to the upper surface of the sample.   
     
     
         6 . The apparatus according to  claim 5 , wherein
 the image detection optical system of the optical microscope has a polarization detector configured to detect a polarization direction different from a polarization direction of the light output from the dark field illumination optical system.   
     
     
         7 . An apparatus for reviewing a defect, comprising:
 a stage;   an optical microscope configured to optically re-detect an existing defect on a sample placed on the stage and configured to obtain position information of the existing defect on the sample; and   a scanning electron microscope configured to review the existing defect on the sample placed on the stage, by positioning the existing defect on the sample within a visual field of the scanning electron microscope by moving the stage based on the position information of the existing defect re-detected by the optical microscope,   wherein the optical microscope includes:
 an illumination optical system configured to illuminate the existing defect on the sample with light; and 
 an image detecting optical system configured to converge and detect reflected light or scattered light generated from the existing defect on the sample illuminated by the illumination optical system, thereby obtaining an image signal, 
 wherein the image detection optical system determines a detection condition based on defect information detected by an external inspection apparatus. 
   
     
     
         8 . The apparatus according to  claim 7 ,
 wherein the optical microscope includes:   an optical height detection system configured to optically detect a vertical position of an upper surface of the sample placed on the stage.   
     
     
         9 . The apparatus according to  claim 8 , wherein the optical microscope includes:
 a focus adjusting means configured to adjust a focus position of the optical microscope based on the vertical position of the upper surface of the sample, the vertical position being detected by the optical height detection system.   
     
     
         10 . The apparatus according to  claim 8 , wherein
 the optical height detection system of the optical microscope is configured to project slit light on the sample through an objective lens provided for the optical microscope, to detect slit reflection light reflected from the sample due to the projection of the slit light by an optical sensor through the objective lens, and to detect a vertical position of the upper surface of the sample based on position of the slit reflection light detected by the optical sensor.   
     
     
         11 . The apparatus according to  claim 7 , wherein
 the illumination optical system of the optical microscope includes a dark field illumination optical system configured to illuminate the existing defect on the sample with the light from a direction that inclines to the upper surface of the sample.   
     
     
         12 . The apparatus according to  claim 11 , wherein
 the image detection optical system of the optical microscope has a polarization detector configured to detect a polarization direction different from a polarization direction of the light output from the dark field illumination optical system.   
     
     
         13 . A method for reviewing a defect, comprising the steps of:
 obtaining position information of a defect on a sample placed on a stage by optically re-detecting the existing defect on the sample with an optical microscope; and   reviewing the existing defect on the sample with a scanning electron microscope by positioning the existing defect on the sample within a visual field of the scanning electron microscope by moving the stage based on the position information of the existing defect on the sample;   wherein the step of obtaining position information of a defect on a sample includes:
 illuminating the existing defect on the sample with light; 
 converging and detecting reflected light or scattered light generated from the existing defect on the sample illuminated by the light; and 
 obtaining an image signal by the detection of the reflected light or scattered light, 
 wherein the step of converging and detecting, a detection condition is determined based on defect information detected by an external inspection apparatus. 
   
     
     
         14 . The method according to  claim 13 ,
 wherein the step of obtaining position information includes:   optically detecting a vertical position of an upper surface of the sample on the stage.   
     
     
         15 . The method according to  claim 14 , wherein the step of obtaining position information further includes:
 adjusting a focus position of the optical microscope based on the vertical position of the upper surface of the sample, the vertical position being detected by the optically detecting.   
     
     
         16 . The method according to  claim 14 , wherein
 the optically detecting the vertical position includes projecting slit light on the sample through an objective lens provided for the optical microscope, detecting slit reflection light reflected from the sample due to the projection of the slit light by an optical sensor through the objective lens, and detecting a vertical position of the upper surface of the sample based on position of the slit reflection light detected by the optical sensor.   
     
     
         17 . The method according to  claim 13 , wherein
 the obtaining position information includes illuminating existing defect on the sample with the light from a direction that inclines to the upper surface of the sample.   
     
     
         18 . The method according to  claim 17 , wherein
 the step of converging and detecting further includes detecting a polarization direction of the reflected light or scattered light which is different from a polarization direction of the light illuminated on the sample.