Inventor · disambiguated record
Kenneth M. Sautter
Also filed as: SAUTTER KENNETH · SAUTTER KENNETH M
24 granted patents·2 pending applications·1,161 citations·filing 1985–2025
97Inventor score
Top patents by PatentIndex Score
26 records- 0198US5675180AVertical interconnect process for silicon segmentsCUBIC MEMORY INC·Filed 1994·Granted Oct 7, 1997·172 cites·21 claims
- 0297US11456274B1Method of using a processing ovenYIELD ENG SYSTEMS INC·Filed 2022·Granted Sep 27, 2022·6 cites·20 claims
- 0397US5891761AMethod for forming vertical interconnect process for silicon segments with thermally conductive epoxy preformCUBIC MEMORY INC·Filed 1997·Granted Apr 6, 1999·151 cites·22 claims
- 0496US11465225B1Method of using processing ovenYIELD ENG SYSTEMS INC·Filed 2022·Granted Oct 11, 2022·7 cites·18 claims
- 0596US5661087AVertical interconnect process for silicon segmentsCUBIC MEMORY INC·Filed 1995·Granted Aug 26, 1997·104 cites·6 claims
- 0695US11850672B2Method of using processing ovenYIELD ENG SYSTEMS INC·Filed 2022·Granted Dec 26, 2023·3 cites·20 claims
- 0794US11919036B1Method of improving the adhesion strength of metal-organic interfaces in electronic devicesYIELD ENG SYSTEMS INC·Filed 2023·Granted Mar 5, 2024·2 cites·15 claims
- 0893US5657206AConductive epoxy flip-chip package and methodCUBIC MEMORY INC·Filed 1995·Granted Aug 12, 1997·73 cites·15 claims
- 0992US12330228B2Method of using processing ovenYIELD ENG SYSTEMS INC·Filed 2023·Granted Jun 17, 2025·1 cites·20 claims
- 1092US6134118AConductive epoxy flip-chip package and methodCUBIC MEMORY INC·Filed 1997·Granted Oct 17, 2000·73 cites·18 claims
- 1191US5698895ASilicon segment programming method and apparatusCUBIC MEMORY INC·Filed 1995·Granted Dec 16, 1997·70 cites·6 claims
- 1290US8361548B2Method for efficient coating of substrates including plasma cleaning and dehydrationYIELD ENGINEERING SYSTEMS INC·Filed 2008·Granted Jan 29, 2013·9 cites·9 claims
- 1389US5837566AVertical interconnect process for silicon segmentsCUBIC MEMORY INC·Filed 1997·Granted Nov 17, 1998·56 cites·5 claims
- 1488US6255726B1Vertical interconnect process for silicon segments with dielectric isolationCUBIC MEMORY INC·Filed 1997·Granted Jul 3, 2001·72 cites·23 claims
- 1586US6177296B1Method for forming vertical interconnect process for silicon segments with thermally conductive epoxy preformCUBIC MEMORY INC·Filed 1999·Granted Jan 23, 2001·55 cites·23 claims
- 1686US4647172AResist development methodGCA CORP·Filed 1985·Granted Mar 3, 1987·47 cites·3 claims
- 1784US11818849B1Increasing adhesion of metal-organic interfaces by silane vapor treatmentYIELD ENG SYSTEMS INC·Filed 2023·Granted Nov 14, 2023·1 cites·20 claims
- 1883US6080596AMethod for forming vertical interconnect process for silicon segments with dielectric isolationCUBIC MEMORY INC·Filed 1997·Granted Jun 27, 2000·75 cites·19 claims
- 1983US2025276394A1Method of using processing ovenYIELD ENG SYSTEMS INC·Filed 2025·Application pending·0 cites
- 2078US4977330AIn-line photoresist thickness monitorBATCHELDER TOM W·Filed 1989·Granted Dec 11, 1990·51 cites·12 claims
- 2173US5936302ASpeaker diaphragmCUBIC MEMORY INC·Filed 1997·Granted Aug 10, 1999·27 cites·8 claims
- 2272US6124633AVertical interconnect process for silicon segments with thermally conductive epoxy preformCUBIC MEMORY·Filed 1997·Granted Sep 26, 2000·39 cites·21 claims
- 2368US6486528B1Silicon segment programming apparatus and three terminal fuse configurationVERTICAL CIRCUITS INC·Filed 1999·Granted Nov 26, 2002·28 cites·8 claims
- 2468US6188126B1Vertical interconnect process for silicon segmentsCUBIC MEMORY INC·Filed 1997·Granted Feb 13, 2001·20 cites·3 claims
- 2564US5994170ASilicon segment programming methodCUBIC MEMORY INC·Filed 1997·Granted Nov 30, 1999·19 cites·4 claims
- 2662US2024357749A1Electronic device with improved interfacial adhesion of metal-organic interfacesYIELD ENG SYSTEMS INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →