Inventor · disambiguated record
Keung Jin Sohn
Also filed as: SOHN KEUNG JIN
5 granted patents·20 pending applications·7 citations·filing 2008–2015
70Inventor score
Top patents by PatentIndex Score
25 records- 0172US8344261B2Carrier substrate, fabrication method thereof, printed circuit board using the same, and fabrication method thereofSAMSUNG ELECTRO MECH·Filed 2010·Granted Jan 1, 2013·2 cites·3 claims
- 0267US8156635B2Carrier for manufacturing a printed circuit boardCHO SEONG MIN·Filed 2010·Granted Apr 17, 2012·3 cites·7 claims
- 0360US8397378B2Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit boardSOHN KEUNG-JIN·Filed 2008·Granted Mar 19, 2013·2 cites·15 claims
- 0455US2009250253A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 0553US2012012379A1Printed circuit boardPARK HO-SIK·Filed 2011·Application pending·0 cites
- 0653US2013062112A1Fabrication method for carrier substrate, printed circuit board using the same, and fabrication method thereofSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 0753US2012030938A1Method of manufacturing printed circuit boardPARK HO-SIK·Filed 2011·Application pending·0 cites
- 0853US2012018195A1Printed circuit boardPARK HO-SIK·Filed 2011·Application pending·0 cites
- 0949US8450618B2Printed circuit board with reinforced thermoplastic resin layerSOHN KEUNG-JIN·Filed 2011·Granted May 28, 2013·0 cites·4 claims
- 1049US2014060899A1Prepreg, copper clad laminate, and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 1148US2009288293A1Metal core package substrate and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1248US2016139068A1Method for measuring coefficient of thermal expansion and thermal mechanical analyzerSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1347US2011180205A1Carrier for manufacturing substrate and method of manufacturing substrate using the sameSAMSUNG ELECTRO MECH·Filed 2011·Application pending·0 cites
- 1447US2015041206A1Laminate for printed circuit board, printed circuit board using the same, and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1545US2015114693A1Insulating resin composition for printed circuit board and products manufactured by using the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1642US2015107760A1Carrier and method of manufacturing printed circuit board using the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1742US2014027156A1Multilayer type coreless substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 1841US2011315745A1Carrier for manufacturing substrate and method of manufacturing substrate using the sameCHO SEONG MIN·Filed 2011·Application pending·0 cites
- 1939US2011139858A1Carrier for manufacturing substrate and method of manufacturing substrate using the sameCHO SEONG MIN·Filed 2010·Application pending·0 cites
- 2037US8415200B2Method for manufacturing semiconductor packageHWANG MI SUN·Filed 2011·Granted Apr 9, 2013·0 cites·17 claims
- 2137US2013119540A1Semiconductor package and method for manufacturing the sameHONG JONG KUK·Filed 2012·Application pending·0 cites
- 2236US2016237303A1Resin composition for printed circuit board, insulating film, and printed circuit board using the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 2335US2011138615A1Carrier for manufacturing printed circuit board and method of manufacturing the same and method of manufacturing printed circuit board using the sameSOHN KEUNG JIN·Filed 2010·Application pending·0 cites
- 2435US2012152753A1Method of manufacturing printed circuit boardLEE SUK WON·Filed 2011·Application pending·0 cites
- 2528US2012103671A1Printed circuit board and method for manufacturing the sameLEE EUNG SUEK·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →