Inventor · disambiguated record
Kenichiro Sonoda
Also filed as: SONODA KENICHIRO
16 granted patents·5 pending applications·187 citations·filing 1995–2024
93Inventor score
Top patents by PatentIndex Score
21 records- 0192US8956941B2Manufacturing method of semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Feb 17, 2015·11 cites·13 claims
- 0285US9184264B2Manufacturing method of semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Nov 10, 2015·5 cites·13 claims
- 0378US6696341B1Method of manufacturing a semiconductor device having electrostatic discharge protection elementRENESAS TECH CORP·Filed 2000·Granted Feb 24, 2004·26 cites·10 claims
- 0474US10217759B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Feb 26, 2019·2 cites·15 claims
- 0573US10026481B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Jul 17, 2018·3 cites·16 claims
- 0671US6240375B1Method of simulating an integrated circuit for error correction in a configuration model, and a computer-readable recording mediumMITSUBISHI ELECTRIC CORP·Filed 1998·Granted May 29, 2001·62 cites·19 claims
- 0770US6484948B1Authentication method, authentication apparatus, authentication system and IC cardMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Nov 26, 2002·18 cites·10 claims
- 0869US9780109B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Oct 3, 2017·1 cites·15 claims
- 0965US2023067226A1Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2022·Application pending·0 cites
- 1061US11923296B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2022·Granted Mar 5, 2024·0 cites·17 claims
- 1157US6198135B1Semiconductor device having electrostatic discharge protection element and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Mar 6, 2001·17 cites·8 claims
- 1257US2025046705A1Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1356US10062706B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Aug 28, 2018·0 cites·4 claims
- 1455US2019006382A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 1550US2016093716A1Manufacturing method of semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 1647US6591233B1Device for and method of simulation, method of setting manufacturing process condition, and recording mediumMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jul 8, 2003·19 cites·9 claims
- 1745US10438663B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Oct 8, 2019·0 cites·9 claims
- 1842US6662143B2Measuring method and measuring deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Dec 9, 2003·2 cites·12 claims
- 1942US2003149555A1Method of simulationMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 2040US5845105AMethod of simulating semiconductor manufacture with process functions according to user applicationMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Dec 1, 1998·12 cites·22 claims
- 2137US5627772AMethod and apparatus for device simulationMITSUBISHI ELECTRIC CORP·Filed 1995·Granted May 6, 1997·9 cites·28 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →