Inventor · disambiguated record
Keith Tatseun Wong
Also filed as: WONG KEITH · WONG KEITH T · WONG Keith Tatseun
29 granted patents·14 pending applications·172 citations·filing 2007–2025
95Inventor score
Top patents by PatentIndex Score
43 records- 0197US10622214B2Tungsten defluorination by high pressure treatmentAPPLIED MATERIALS INC·Filed 2017·Granted Apr 14, 2020·15 cites·20 claims
- 0297US10529603B2High pressure wafer processing systems and related methodsMICROMATERIALS LLC·Filed 2019·Granted Jan 7, 2020·20 cites·20 claims
- 0397US10269571B2Methods for fabricating nanowire for semiconductor applicationsAPPLIED MATERIALS INC·Filed 2017·Granted Apr 23, 2019·19 cites·20 claims
- 0497US10224224B2High pressure wafer processing systems and related methodsMICROMATERIALS LLC·Filed 2017·Granted Mar 5, 2019·19 cites·24 claims
- 0597US10179941B1Gas delivery system for high pressure processing chamberMICROMATERIALS LLC·Filed 2017·Granted Jan 15, 2019·29 cites·18 claims
- 0696US10636704B2Seam-healing method upon supra-atmospheric process in diffusion promoting ambientAPPLIED MATERIALS INC·Filed 2018·Granted Apr 28, 2020·14 cites·20 claims
- 0795US10847360B2High pressure treatment of silicon nitride filmAPPLIED MATERIALS INC·Filed 2017·Granted Nov 24, 2020·15 cites·17 claims
- 0895US10790183B2Selective oxidation for 3D device isolationAPPLIED MATERIALS INC·Filed 2019·Granted Sep 29, 2020·14 cites·20 claims
- 0995US10049927B2Seam-healing method upon supra-atmospheric process in diffusion promoting ambientAPPLIED MATERIALS INC·Filed 2016·Granted Aug 14, 2018·14 cites·20 claims
- 1090US11542597B2Selective deposition of metal oxide by pulsed chemical vapor depositionAPPLIED MATERIALS INC·Filed 2020·Granted Jan 3, 2023·2 cites·20 claims
- 1184US10192752B2Self-assembled monolayer blocking with intermittent air-water exposureAPPLIED MATERIALS INC·Filed 2017·Granted Jan 29, 2019·3 cites·20 claims
- 1280US10916426B2Formation of crystalline, layered transition metal dichalcogenidesAPPLIED MATERIALS INC·Filed 2019·Granted Feb 9, 2021·2 cites·21 claims
- 1379US11993845B2High selectivity atomic layer deposition processAPPLIED MATERIALS INC·Filed 2020·Granted May 28, 2024·1 cites·18 claims
- 1475US2025347996A1Apparatus and method of patterning a substrate using an organoindium resistAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1574US12198951B2High pressure wafer processing systems and related methodsAPPLIED MATERIALS INC·Filed 2018·Granted Jan 14, 2025·1 cites·17 claims
- 1674US10818510B2Self-assembled monolayer blocking with intermittent air-water exposureAPPLIED MATERIALS INC·Filed 2019·Granted Oct 27, 2020·1 cites·16 claims
- 1772US2025054739A1Self-assembled monolayer deposition from low vapor pressure organic moleculesAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1871US2023377958A1Cluster processing system for forming a metal containing materialAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1970US2024035152A1Methods for depositing molybdenum sulfideAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2068US11993842B2Selective deposition of metal oxide by pulsed chemical vapor depositionAPPLIED MATERIALS INC·Filed 2022·Granted May 28, 2024·0 cites·20 claims
- 2166US11821079B2Methods for depositing molybdenum sulfideAPPLIED MATERIALS INC·Filed 2020·Granted Nov 21, 2023·0 cites·19 claims
- 2264US11705337B2Tungsten defluorination by high pressure treatmentAPPLIED MATERIALS INC·Filed 2019·Granted Jul 18, 2023·0 cites·22 claims
- 2364US7799501B2PhotoreceptorsXEROX CORP·Filed 2007·Granted Sep 21, 2010·2 cites·7 claims
- 2463US2024306391A1Contact construction for semiconductor devices with low-dimensional materialsAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2562US12142467B2Self-assembled monolayer deposition from low vapor pressure organic moleculesAPPLIED MATERIALS INC·Filed 2021·Granted Nov 12, 2024·0 cites·13 claims
- 2662US7755759B2Methods and systems for evaluating pigment dispersionsXEROX CORP·Filed 2007·Granted Jul 13, 2010·1 cites·16 claims
- 2761US2025191908A1Tunability of dopant concentration in thin hafnium oxide filmsAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 2858US11756828B2Cluster processing system for forming a transition metal materialAPPLIED MATERIALS INC·Filed 2018·Granted Sep 12, 2023·0 cites·13 claims
- 2958US11626284B2Method of forming a 2-dimensional channel material, using ion implantationAPPLIED MATERIALS INC·Filed 2021·Granted Apr 11, 2023·0 cites·20 claims
- 3058US2025253187A1Flowable chemical vapor deposition (fcvd) and sacrificial etch protection processesAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3157US12305279B2Ultra high-k hafnium oxide and hafnium zirconium oxide filmsAPPLIED MATERIALS INC·Filed 2023·Granted May 20, 2025·0 cites·17 claims
- 3257US2022310776A1Integrated platform for tin pvd and high-k ald for beol mim capacitorAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 3354US2019119769A1Gas delivery system for high pressure processing chamberMICROMATERIALS LLC·Filed 2018·Application pending·0 cites
- 3452US12211736B2Flowable chemical vapor deposition of metal oxidesAPPLIED MATERIALS INC·Filed 2021·Granted Jan 28, 2025·0 cites·20 claims
- 3552US2025266294A1Methods for depositing silicon oxideAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 3651US10957590B2Method for forming a layerAPPLIED MATERIALS INC·Filed 2019·Granted Mar 23, 2021·0 cites·12 claims
- 3751US2024420934A1In-situ etch and inhibition in plasma enhanced atomic layer depositionAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3850US2023187204A1Tungsten Fluoride Soak And Treatment For Tungsten Oxide RemovalAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 3949US12261037B2Tunability of dopant concentration in thin hafnium oxide filmsAPPLIED MATERIALS INC·Filed 2019·Granted Mar 25, 2025·0 cites·17 claims
- 4047US11664215B2High selectivity atomic later deposition processAPPLIED MATERIALS INC·Filed 2020·Granted May 30, 2023·0 cites·15 claims
- 4144US10062561B2High-pressure annealing and reducing wet etch ratesAPPLIED MATERIALS INC·Filed 2016·Granted Aug 28, 2018·0 cites·17 claims
- 4243US2019362965A1Methods of patterning a wafer substrateAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 4339US2010300563A1Modular device and method for moving fluids to and from a sample delivery elementRAMUNAS JOHN·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →