Inventor · disambiguated record
Kevin P. Yanders
Also filed as: YANDERS KEVIN · YANDERS KEVIN P · YANDERS KEVIN PAUL
7 granted patents·3 pending applications·155 citations·filing 1993–2015
87Inventor score
Files withADVANCED TECH MATERIALS2ADVANCED TEHNOLOGY MATERIALS I1AGERE SYST GUARDIAN CORP1AT & T BELL LAB1BARNES JEFFREY A1
Top patents by PatentIndex Score
10 records- 0192US7365045B2Aqueous cleaner with low metal etch rate comprising alkanolamine and tetraalkylammonium hydroxideADVANCED TEHNOLOGY MATERIALS I·Filed 2005·Granted Apr 29, 2008·32 cites·14 claims
- 0290US8778210B2Compositions and methods for the selective removal of silicon nitrideCOOPER EMANUEL I·Filed 2007·Granted Jul 15, 2014·26 cites·17 claims
- 0384US7922823B2Compositions for processing of semiconductor substratesADVANCED TECH MATERIALS·Filed 2006·Granted Apr 12, 2011·12 cites·10 claims
- 0482US9691629B2Compositions and methods for the selective removal of silicon nitrideENTEGRIS INC·Filed 2015·Granted Jun 27, 2017·3 cites·11 claims
- 0579US5336371ASemiconductor wafer cleaning and rinsing techniques using re-ionized water and tank overflowAT & T BELL LAB·Filed 1993·Granted Aug 9, 1994·74 cites·12 claims
- 0673US9158203B2Compositions and methods for the selective removal of silicon nitrideADVANCED TECH MATERIALS·Filed 2014·Granted Oct 13, 2015·2 cites·19 claims
- 0753US6361614B1Dark spin rinse/dryAGERE SYST GUARDIAN CORP·Filed 2000·Granted Mar 26, 2002·6 cites·12 claims
- 0851US2009120457A1Compositions and method for removing coatings and preparation of surfaces for use in metal finishing, and manufacturing of electronic and microelectronic devicesSURFACE CHEMISTRY DISCOVERIES·Filed 2008·Application pending·0 cites
- 0951US2008200361A1Aqueous cleaner with low metal etch rateWALKER ELIZABETH L·Filed 2008·Application pending·0 cites
- 1039US2008076688A1Copper passivating post-chemical mechanical polishing cleaning composition and method of useBARNES JEFFREY A·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →