Inventor · disambiguated record
Kim-Yong Goh
Also filed as: GOH KIM-YONG
24 granted patents·6 pending applications·179 citations·filing 2004–2017
95Inventor score
Files withST MICROELECTRONICS PTE LTD11GOH KIM-YONG10ST MICROELECTRONICS ASIA3ZHANG XUEREN3STMICROELECTRONICS (MALTA) LTD2
Top patents by PatentIndex Score
30 records- 0195US8884422B2Flip-chip fan-out wafer level package for package-on-package applications, and method of manufactureGOH KIM-YONG·Filed 2009·Granted Nov 11, 2014·46 cites·8 claims
- 0295US8436255B2Fan-out wafer level package with polymeric layer for high reliabilityGOH KIM-YONG·Filed 2009·Granted May 7, 2013·40 cites·12 claims
- 0391US9449912B1Integrated circuit (IC) card having an IC module and reduced bond wire stress and method of formingST MICROELECTRONICS PTE LTD·Filed 2015·Granted Sep 20, 2016·11 cites·24 claims
- 0489US8018036B2Ultra-thin quad flat no-lead (QFN) packageST MICROELECTRONICS ASIA·Filed 2006·Granted Sep 13, 2011·18 cites·26 claims
- 0586US8389335B2Chip Scale Package structure with can attachmentGOH KIM-YONG·Filed 2012·Granted Mar 5, 2013·7 cites·16 claims
- 0685US8466997B2Fan-out wafer level package for an optical sensor and method of manufacture thereofGOH KIM-YONG·Filed 2009·Granted Jun 18, 2013·8 cites·13 claims
- 0781US9576912B1Wafer level chip scale package (WLCSP) having edge protectionST MICROELECTRONICS PTE LTD·Filed 2015·Granted Feb 21, 2017·4 cites·15 claims
- 0881US8772943B2Offset of contact opening for copper pillars in flip chip packagesZHANG XUEREN·Filed 2011·Granted Jul 8, 2014·7 cites·14 claims
- 0979US9620438B2Electronic device with heat dissipaterSTMICROELECTRONICS (MALTA) LTD·Filed 2015·Granted Apr 11, 2017·5 cites·23 claims
- 1075US7956475B2Step cavity for enhanced drop test performance in ball grid array packageST MICROELECTRONICS ASIA·Filed 2008·Granted Jun 7, 2011·6 cites·14 claims
- 1171US8502394B2Multi-stacked semiconductor dice scale package structure and method of manufacturing sameGOH KIM-YONG·Filed 2009·Granted Aug 6, 2013·5 cites·19 claims
- 1268US8164179B2Chip scale package structure with can attachmentGOH KIM-YONG·Filed 2008·Granted Apr 24, 2012·3 cites·11 claims
- 1364US8796826B2Window clamp top plate for integrated circuit packagingZHANG XUEREN·Filed 2011·Granted Aug 5, 2014·2 cites·29 claims
- 1463US7361995B2Molded high density electronic packaging structure for high performance applicationsXILINX INC·Filed 2004·Granted Apr 22, 2008·13 cites·24 claims
- 1562US9379034B1Method of making an electronic device including two-step encapsulation and related devicesST MICROELECTRONICS PTE LTD·Filed 2014·Granted Jun 28, 2016·1 cites·21 claims
- 1661US8642396B2Ultra-thin quad flat no-lead (QFN) packageGOH KIM-YONG·Filed 2011·Granted Feb 4, 2014·1 cites·23 claims
- 1761US8410598B2Semiconductor package and method of manufacturing the sameGOH KIM-YONG·Filed 2010·Granted Apr 2, 2013·1 cites·8 claims
- 1860US9257372B2Surface mount package for a semiconductor integrated device, related assembly and manufacturing processSTMICROELECTRONICS MALTA LTD·Filed 2013·Granted Feb 9, 2016·1 cites·16 claims
- 1959US10658238B2Semiconductor packages having an electric device with a recessST MICROELECTRONICS PTE LTD·Filed 2017·Granted May 19, 2020·0 cites·19 claims
- 2054US9824924B2Semiconductor packages having an electric device with a recessST MICROELECTRONICS PTE LTD·Filed 2013·Granted Nov 21, 2017·0 cites·16 claims
- 2149US2011156240A1Reliable large die fan-out wafer level package and method of manufactureST MICROELECTRONICS ASIA·Filed 2009·Application pending·0 cites
- 2244US8637352B2Ball grid array to pin grid array conversionGOH KIM-YONG·Filed 2011·Granted Jan 28, 2014·0 cites·12 claims
- 2344US2015332995A1Electronic device including components in component receiving cavity and related methodsST MICROELECTRONICS PTE LTD·Filed 2014·Application pending·0 cites
- 2443US9679870B2Integrated circuit device with shaped leads and method of forming the deviceST MICROELECTRONICS PTE LTD·Filed 2014·Granted Jun 13, 2017·0 cites·10 claims
- 2542US2015084171A1No-lead semiconductor package and method of manufacturing the sameST MICROELECTRONICS PTE LTD·Filed 2013·Application pending·0 cites
- 2640US8907465B2Methods and devices for packaging integrated circuitsST MICROELECTRONICS PTE LTD·Filed 2013·Granted Dec 9, 2014·0 cites·18 claims
- 2737US2013147024A1Balanced leadframe package structure and method of manufacturing the sameGOH KIM-YONG·Filed 2011·Application pending·0 cites
- 2836US2013093072A1Leadframe pad design with enhanced robustness to die crack failureZHANG XUEREN·Filed 2011·Application pending·0 cites
- 2934US8822267B2System in package manufacturing method using wafer-to-wafer bondingST MICROELECTRONICS PTE LTD·Filed 2012·Granted Sep 2, 2014·0 cites·20 claims
- 3033US2016293512A1Electronic device with dummy ic die and related methodsST MICROELECTRONICS PTE LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →