Inventor · disambiguated record
Kieran P. Harney
Also filed as: HARNEY KIERAN · HARNEY KIERAN P · HARNEY KIERAN PATRICK
42 granted patents·7 pending applications·702 citations·filing 2001–2022
98Inventor score
Top patents by PatentIndex Score
49 records- 0196US7357017B2Wafer level capped sensorANALOG DEVICES INC·Filed 2007·Granted Apr 15, 2008·42 cites·7 claims
- 0296US6555417B2Method and device for protecting micro electromechanical system structures during dicing of a waferANALOG DEVICES INC·Filed 2001·Granted Apr 29, 2003·121 cites·20 claims
- 0394US8477983B2Multi-microphone systemWEIGOLD JASON W·Filed 2006·Granted Jul 2, 2013·40 cites·23 claims
- 0494US8270634B2Multiple microphone systemHARNEY KIERAN P·Filed 2007·Granted Sep 18, 2012·36 cites·16 claims
- 0592US7040922B2Multi-surface mounting member and electronic deviceANALOG DEVICES INC·Filed 2003·Granted May 9, 2006·104 cites·15 claims
- 0692US6936918B2MEMS device with conductive path through substrateANALOG DEVICES INC·Filed 2004·Granted Aug 30, 2005·78 cites·23 claims
- 0790US8841738B2MEMS microphone system for harsh environmentsINVENSENSE INC·Filed 2012·Granted Sep 23, 2014·12 cites·26 claims
- 0890US8223981B2Wide dynamic range microphoneHAILA OLLI·Filed 2009·Granted Jul 17, 2012·27 cites·20 claims
- 0989US8965027B2Packaged microphone with frame having die mounting concavityINVENSENSE INC·Filed 2013·Granted Feb 24, 2015·9 cites·10 claims
- 1089US7928584B2Stacked MEMS deviceANALOG DEVICES INC·Filed 2009·Granted Apr 19, 2011·26 cites·24 claims
- 1188US9738515B2Transducer with enlarged back volumeINVENSENSE INC·Filed 2013·Granted Aug 22, 2017·8 cites·19 claims
- 1288US8767982B2Microphone module with sound pipeANALOG DEVICES INC·Filed 2012·Granted Jul 1, 2014·7 cites·19 claims
- 1387US8130979B2Noise mitigating microphone system and methodHARNEY KIERAN P·Filed 2006·Granted Mar 6, 2012·14 cites·14 claims
- 1487US7642657B2Stacked MEMS deviceANALOG DEVICES INC·Filed 2007·Granted Jan 5, 2010·23 cites·27 claims
- 1587US6768196B2Packaged microchip with isolationANALOG DEVICES INC·Filed 2002·Granted Jul 27, 2004·58 cites·19 claims
- 1685US9002036B2Multiple microphone systemHARNEY KIERAN P·Filed 2012·Granted Apr 7, 2015·8 cites·17 claims
- 1784US10257610B2Microphone module with sound pipeINVENSENSE INC·Filed 2017·Granted Apr 9, 2019·3 cites·23 claims
- 1884US9282389B1Microelectromechanical systems device optimized for flip-chip assembly and method of attaching the sameINVENSENSE INC·Filed 2014·Granted Mar 8, 2016·7 cites·23 claims
- 1984US8351632B2Noise mitigating microphone system and methodANALOG DEVICES INC·Filed 2009·Granted Jan 8, 2013·9 cites·17 claims
- 2084US8111871B2Microphone with pressure reliefZHANG XIN·Filed 2008·Granted Feb 7, 2012·13 cites·24 claims
- 2182US10142718B2Integrated temperature sensor in microphone packageINVENSENSE INC·Filed 2015·Granted Nov 27, 2018·2 cites·21 claims
- 2278US10349170B2Microelectromechanical systems (MEMS) microphone bias voltageINVENSENSE INC·Filed 2018·Granted Jul 9, 2019·3 cites·16 claims
- 2378US9338538B2Multi-microphone systemINVENSENSE INC·Filed 2013·Granted May 10, 2016·4 cites·14 claims
- 2478US6946326B2Method and device for protecting micro electromechanical systems structures during dicing of a waferANALOG DEVICES INC·Filed 2001·Granted Sep 20, 2005·15 cites·70 claims
- 2577US10045121B2Microelectromechanical systems (MEMS) microphone bias voltageINVENSENSE INC·Filed 2016·Granted Aug 7, 2018·3 cites·19 claims
- 2675US9332332B2Packaged microphone with frame having die mounting concavityINVENSENSE INC·Filed 2015·Granted May 3, 2016·2 cites·16 claims
- 2772US8995693B2Noise mitigating microphone system and methodINVENSENSE INC·Filed 2012·Granted Mar 31, 2015·2 cites·30 claims
- 2871US9078068B2Microphone with aligned aperturesLANGLOIS ERIC·Filed 2008·Granted Jul 7, 2015·6 cites·22 claims
- 2970US12013282B2Techniques for alternate pressure equalization of a sensorINVENSENSE INC·Filed 2022·Granted Jun 18, 2024·0 cites·14 claims
- 3067US10257609B2Method of forming a packaged microphoneINVENSENSE INC·Filed 2016·Granted Apr 9, 2019·1 cites·18 claims
- 3167US9008323B2Wide dynamic range microphoneHAILA OLLI·Filed 2012·Granted Apr 14, 2015·2 cites·10 claims
- 3264US10911850B2Integrated temperature sensor in microphone packageINVENSENSE INC·Filed 2018·Granted Feb 2, 2021·0 cites·20 claims
- 3364US9544673B2Microphone with built-in speaker driverINVENSENSE INC·Filed 2014·Granted Jan 10, 2017·2 cites·27 claims
- 3463US9681242B2MEMS microphone system for harsh environmentsINVENSENSE INC·Filed 2014·Granted Jun 13, 2017·1 cites·20 claims
- 3562US6931170B2Fiber-attached optical devices with in-plane micromachined mirrorsANALOG DEVICES INC·Filed 2002·Granted Aug 16, 2005·8 cites·13 claims
- 3660US6825744B2Active alignment as an integral part of optical package designANALOG DEVICES INC·Filed 2002·Granted Nov 30, 2004·6 cites·12 claims
- 3756US9173015B2Microphone module with sound pipeHARNEY KIERAN P·Filed 2014·Granted Oct 27, 2015·0 cites·17 claims
- 3855US11467025B2Techniques for alternate pressure equalization of a sensorINVENSENSE INC·Filed 2019·Granted Oct 11, 2022·0 cites·25 claims
- 3953US10399850B2Transducer with enlarged back volumeINVENSENSE INC·Filed 2017·Granted Sep 3, 2019·0 cites·17 claims
- 4051US2016044409A1Microphone module with sound pipeINVENSENSE INC·Filed 2015·Application pending·0 cites
- 4150US9407996B2Wide dynamic range microphoneINVENSENSE INC·Filed 2015·Granted Aug 2, 2016·0 cites·8 claims
- 4249US2008150104A1Leadframe with different topologies for mems packageZIMMERMAN MICHAEL A·Filed 2007·Application pending·0 cites
- 4348US2015271617A1Microphone with aligned aperturesINVENSENSE INC·Filed 2015·Application pending·0 cites
- 4444US2008175425A1Microphone System with Silicon Microphone Secured to Package LidANALOG DEVICES INC·Filed 2007·Application pending·0 cites
- 4541US10206047B2Micro-electro-mechanical system microphone with dual backplatesINVENSENSE INC·Filed 2016·Granted Feb 12, 2019·0 cites·18 claims
- 4641US10031877B2Including control data in a serial audio streamINVENSENSE INC·Filed 2015·Granted Jul 24, 2018·0 cites·24 claims
- 4741US2019166424A1Microphone mesh networkINVENSENSE INC·Filed 2018·Application pending·0 cites
- 4841US2007040231A1Partially etched leadframe packages having different top and bottom topologiesHARNEY KIERAN P·Filed 2006·Application pending·0 cites
- 4936US2005054133A1Wafer level capped sensorFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →