US2015271617A1PendingUtilityA1
Microphone with aligned apertures
Est. expiryJun 6, 2027(~0.8 yrs left)· nominal 20-yr term from priority
H04R 19/005H04R 2201/003H04R 31/00H04R 2499/11B81C 1/00523H04R 1/222H04R 19/04B81C 1/00158Y10T29/49005B81C 1/00182
48
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Claims
Abstract
A MEMS microphone has a backplate with a given backplate aperture, and a diaphragm having a diaphragm aperture. The given backplate aperture is substantially aligned with the diaphragm aperture.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method of forming a MEMS microphone, the method comprising:
providing a backplate; forming a diaphragm spaced from the backplate, the diaphragm forming a diaphragm aperture; and forming a plurality of backplate apertures, a given aperture of the backplate apertures being at least partially aligned with the diaphragm aperture.
2 . The method as defined by claim 1 wherein the given aperture is substantially aligned with the diaphragm aperture.
3 . The method as defined by claim 1 wherein the plurality of backplate apertures includes a second aperture that is offset from the diaphragm aperture.
4 . The method as defined by claim 1 wherein forming a diaphragm comprises:
depositing a deposition material onto a sacrificial material supported by the backplate;
forming a plurality of springs; and
removing the sacrificial material to form the diaphragm, the plurality of springs suspending the diaphragm, the diaphragm being vertically spaced from the backplate.
5 . The method as defined by claim 1 wherein providing a backplate comprises forming the backplate from an SOI wafer.
6 . The method as defined by claim 1 wherein forming a plurality of backplate apertures includes etching a slot through a wafer.Join the waitlist — get patent alerts
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