Inventor · disambiguated record
King Yi Heung
Also filed as: HEUNG KING YI
7 granted patents·2 pending applications·40 citations·filing 2011–2020
82Inventor score
Top patents by PatentIndex Score
9 records- 0194US10493590B2Selection of polishing parameters to generate removal or pressure profileAPPLIED MATERIALS INC·Filed 2015·Granted Dec 3, 2019·8 cites·22 claims
- 0290US9213340B2Selection of polishing parameters to generate removal or pressure profileAPPLIED MATERIALS INC·Filed 2014·Granted Dec 15, 2015·11 cites·21 claims
- 0388US10589399B2Textured small pad for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2017·Granted Mar 17, 2020·3 cites·5 claims
- 0487US8774958B2Selection of polishing parameters to generate removal profileZHANG HUANBO·Filed 2011·Granted Jul 8, 2014·15 cites·21 claims
- 0578US10256111B2Chemical mechanical polishing automated recipe generationAPPLIED MATERIALS INC·Filed 2017·Granted Apr 9, 2019·3 cites·18 claims
- 0658US2020282506A1Spiral and concentric movement designed for cmp location specific polish (lsp)APPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 0755US10434623B2Local area polishing system and polishing pad assemblies for a polishing systemAPPLIED MATERIALS INC·Filed 2017·Granted Oct 8, 2019·0 cites·19 claims
- 0851US2018250788A1Spiral and concentric movement designed for cmp location specific polish (lsp)APPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
- 0938US10610994B2Polishing system with local area rate control and oscillation modeAPPLIED MATERIALS INC·Filed 2017·Granted Apr 7, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →