Inventor · disambiguated record
Kiminori Ishido
Also filed as: ISHIDO KIMINORI
15 granted patents·3 pending applications·413 citations·filing 1992–2016
93Inventor score
Files withJ-DEVICES CORP6NEC CORP6NEC ELECTRONICS CORP3ISHIDO KIMINORI1NEC TOPPAN CIRCUIT SOLUTIONS1
Top patents by PatentIndex Score
18 records- 0196US5258094AMethod for producing multilayer printed wiring boardsNEC CORP·Filed 1992·Granted Nov 2, 1993·292 cites·6 claims
- 0289US9368474B2Manufacturing method for semiconductor deviceJ DEVICES CORP·Filed 2015·Granted Jun 14, 2016·8 cites·21 claims
- 0387US8367939B2Interconnect substrate, method of manufacturing interconnect substrate and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Feb 5, 2013·17 cites·27 claims
- 0486US9635762B2Semiconductor packageJ-DEVICES CORP·Filed 2015·Granted Apr 25, 2017·6 cites·11 claims
- 0580US9553052B2Magnetic shielding package of non-volatile magnetic memory elementJ-DEVICES CORP·Filed 2015·Granted Jan 24, 2017·4 cites·4 claims
- 0676US10256196B2Semiconductor device and method for manufacturing sameJ DEVICES CORP·Filed 2016·Granted Apr 9, 2019·3 cites·5 claims
- 0771US6791675B2Optical waveguide path, manufacturing method and coupling method of the same, and optical waveguide path coupling structureNEC TOPPAN CIRCUIT SOLUTIONS·Filed 2001·Granted Sep 14, 2004·13 cites·17 claims
- 0867US8174117B2Semiconductor device and method of manufacturing the sameISHIDO KIMINORI·Filed 2008·Granted May 8, 2012·5 cites·21 claims
- 0964US5658611ASurface protection material for printed circuit board and process of forming surface protection filmsNEC CORP·Filed 1995·Granted Aug 19, 1997·23 cites·3 claims
- 1062US9362200B2Heat sink in the aperture of substrateJ DEVICES CORP·Filed 2015·Granted Jun 7, 2016·1 cites·20 claims
- 1162US5458907AMethod of manufacturing printed circuit boards having an oxidation proof coating on a copper or copper alloy circuit patternNEC CORP·Filed 1994·Granted Oct 17, 1995·24 cites·8 claims
- 1248US2008135279A1Printed wiring board having plural solder resist layers and method for production thereofNEC ELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 1346US5746813ASurface protection material for printed circuit board and process of forming surface protection filmsNEC CORP·Filed 1997·Granted May 5, 1998·10 cites·1 claims
- 1445US2010140796A1Manufacturing method of semiconductor device, and semiconductor deviceNEC ELECTRONICS CORP·Filed 2009·Application pending·0 cites
- 1542US5324535AProcess of coating printed wiring board with solid solder resist pattern formed from liquid and dry solder resist filmsNEC CORP·Filed 1993·Granted Jun 28, 1994·6 cites·7 claims
- 1637US2003193094A1Semiconductor device and method for fabricating the sameNEC ELECTRONICS CORP·Filed 2003·Application pending·0 cites
- 1735US9685376B2Semiconductor device and method of manufacturing semiconductor deviceJ-DEVICES CORP·Filed 2015·Granted Jun 20, 2017·0 cites·10 claims
- 1829US5464725AMethod of manufacturing a printed wiring boardNEC CORP·Filed 1992·Granted Nov 7, 1995·1 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →