Inventor · disambiguated record
Ki Seong Jung
Also filed as: JUNG KI S · JUNG KI SEONG
1 granted patent·1 pending application·6 citations·filing 2007–2008
28Inventor score
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2 records- 0167US8211540B2Adhesive film composition, associated dicing die bonding film, die package, and associated methodsHONG YONG WOO·Filed 2008·Granted Jul 3, 2012·6 cites·23 claims
- 0246US2008108721A1Photocurable pressure-sensitive adhesive composition including acrylic binder resin, adhesive tape using the same, and associated methodsHA KYOUNG J·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →