Inventor · disambiguated record
Kil-Soo Kim
Also filed as: KIM KIL N · KIM KIL-SOO
17 granted patents·9 pending applications·177 citations·filing 2004–2023
91Inventor score
Files withSAMSUNG ELECTRONICS CO LTD17KIM KIL-SOO4KARIM MOHAMMAD REZAUL1LEE JIN-YANG1PANTECH & CURITEL COMM INC1
Top patents by PatentIndex Score
26 records- 0196US8791580B2Integrated circuit packages having redistribution structuresPARK CHUL·Filed 2012·Granted Jul 29, 2014·40 cites·18 claims
- 0295US7064435B2Semiconductor package with improved ball land structureSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jun 20, 2006·109 cites·18 claims
- 0381US8643175B2Multi-channel package and electronic system including the sameKIM KIL-SOO·Filed 2012·Granted Feb 4, 2014·7 cites·19 claims
- 0479US11309300B2Semiconductor package including processor chip and memory chipSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 19, 2022·2 cites·14 claims
- 0579US7953043B2Packet switched radio telecommunication system supporting hard handover and method for hard handoverPANTECH & CURITEL COMM INC·Filed 2007·Granted May 31, 2011·8 cites·10 claims
- 0677US9299685B2Multi-chip package having a logic chip disposed in a package substrate opening and connecting to an interposerSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 29, 2016·4 cites·5 claims
- 0771US12482800B2Semiconductor package including processor chip and memory chipSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 25, 2025·0 cites·11 claims
- 0870US10727199B2Electronic device including semiconductor device packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 28, 2020·1 cites·11 claims
- 0970US10699983B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 30, 2020·1 cites·17 claims
- 1068US8487452B2Semiconductor package having a stacked structureLEE JIN-YANG·Filed 2011·Granted Jul 16, 2013·4 cites·17 claims
- 1165US11309280B2Semiconductor device packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 19, 2022·0 cites·15 claims
- 1259US11205637B2Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 21, 2021·0 cites·20 claims
- 1357US2024038727A1Semiconductor package and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1453US10797021B2Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 6, 2020·0 cites·20 claims
- 1549US9072525B2Combinable electrode needle base structureSHIN KYUNG-MIN·Filed 2011·Granted Jul 7, 2015·1 cites·2 claims
- 1647US2006174511A1Clothes drying machineSAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 1745US8018071B2Stacked structure using semiconductor devices and semiconductor device package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Sep 13, 2011·0 cites·15 claims
- 1844US2007158365A1Rubber liquid spray lid having embedded pumping deviceKIM KIL-SOO·Filed 2006·Application pending·0 cites
- 1942US8249023B2Packet switched radio telecommunication system supporting hard handover and method for hard handoverKIM KIL SOO·Filed 2011·Granted Aug 21, 2012·0 cites·8 claims
- 2042US2007176279A1Circuit board, semiconductor package having the same, and method of manufacturing the circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2141US2013082368A1Emi shielded semiconductor package and emi shielded substrate moduleSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 2236US2017243855A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 2336US2010314740A1Semiconductor package, stack module, card, and electronic systemSAMSUNG ELECTRONICS CO LTD·Filed 2010·Application pending·0 cites
- 2435US9691737B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jun 27, 2017·0 cites·16 claims
- 2530US2012251612A1Wound Healing Device, Method for Making the Same and Method for Treating a WoundKARIM MOHAMMAD REZAUL·Filed 2011·Application pending·0 cites
- 2629US2006220246A1Bump land structure of circuit substrate for semiconductor packageKIM KIL-SOO·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →