Inventor · disambiguated record
Ki Wook Lee
Also filed as: LEE KI W · LEE KI WOOK
52 granted patents·19 pending applications·585 citations·filing 1987–2025
98Inventor score
Files withSKYWORKS SOLUTIONS INC26THINKWARE CORP14AMKOR TECHNOLOGY INC12LG ELECTRONICS INC4SIEMENS BENDIX AUTOMOTIVE ELEC4
Top patents by PatentIndex Score
71 records- 0197US11445620B2Method of making printed circuit board structure including a closed cavity with viasSKYWORKS SOLUTIONS INC·Filed 2021·Granted Sep 13, 2022·4 cites·20 claims
- 0297US7898093B1Exposed die overmolded flip chip package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2006·Granted Mar 1, 2011·50 cites·8 claims
- 0397US7579702B2Electric power converting device and power converting method for controlling doubly-fed induction generatorKOREA ELECTROTECH RES INST·Filed 2006·Granted Aug 25, 2009·50 cites·13 claims
- 0496US7843052B1Semiconductor devices and fabrication methods thereofAMKOR TECHNOLOGY INC·Filed 2008·Granted Nov 30, 2010·102 cites·13 claims
- 0595US10700424B2Printed circuit board structure including a closed cavitySKYWORKS SOLUTIONS INC·Filed 2018·Granted Jun 30, 2020·8 cites·13 claims
- 0695US8476748B1Exposed die overmolded flip chip package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2012·Granted Jul 2, 2013·15 cites·20 claims
- 0794US11622453B2Method of making a closed cavity printed circuit board with patterned laminate structureSKYWORKS SOLUTIONS INC·Filed 2021·Granted Apr 4, 2023·2 cites·20 claims
- 0893US10986739B2Method of making printed circuit board structure including a closed cavitySKYWORKS SOLUTIONS INC·Filed 2018·Granted Apr 20, 2021·7 cites·20 claims
- 0992US8847372B1Exposed die overmolded flip chip package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2013·Granted Sep 30, 2014·8 cites·20 claims
- 1092US7638983B2Controller of doubly-fed induction generatorKOREAN ELECTRO TECHNOLOGY RES·Filed 2007·Granted Dec 29, 2009·45 cites·14 claims
- 1192US6770961B2Carrier frame and semiconductor package including carrier frameAMKOR TECHNOLOGY INC·Filed 2002·Granted Aug 3, 2004·74 cites·20 claims
- 1291US11967758B2Printed circuit board structure including a closed cavitySKYWORKS SOLUTIONS INC·Filed 2022·Granted Apr 23, 2024·1 cites·20 claims
- 1391US8368194B1Exposed die overmolded flip chip packageAMKOR TECHNOLOGY INC·Filed 2012·Granted Feb 5, 2013·8 cites·17 claims
- 1490US11527819B2Printed circuit board structure including a closed cavitySKYWORKS SOLUTIONS INC·Filed 2020·Granted Dec 13, 2022·2 cites·20 claims
- 1590US8541260B1Exposed die overmolded flip chip package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2013·Granted Sep 24, 2013·7 cites·20 claims
- 1688US12261127B2Application of conductive via or trench for intra module EMI shieldingSKYWORKS SOLUTIONS INC·Filed 2022·Granted Mar 25, 2025·1 cites·12 claims
- 1788US4888988ASilicon based mass airflow sensor and its fabrication methodSIEMENS BENDIX AUTOMOTIVE ELEC·Filed 1987·Granted Dec 26, 1989·75 cites·43 claims
- 1886US12362267B2Electronic package and method for manufacturing an electronic packageSKYWORKS SOLUTIONS INC·Filed 2021·Granted Jul 15, 2025·1 cites·16 claims
- 1984US11069978B2Method of manufacturing a radio-frequency module with a conformal shield antennaSKYWORKS SOLUTIONS INC·Filed 2018·Granted Jul 20, 2021·3 cites·12 claims
- 2084US7919853B1Semiconductor package and fabrication method thereofAMKOR TECHNOLOGY INC·Filed 2007·Granted Apr 5, 2011·12 cites·17 claims
- 2183US4884443AControl and detection circuitry for mass airflow sensorsSIEMENS BENDIX AUTOMOTIVE ELEC·Filed 1987·Granted Dec 5, 1989·44 cites·33 claims
- 2282US12494414B2Semiconductor device with through-mold viaAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Dec 9, 2025·0 cites·20 claims
- 2382US11892311B2Image processing apparatus, image processing method, computer program and computer readable recording mediumTHINKWARE CORP·Filed 2021·Granted Feb 6, 2024·1 cites·18 claims
- 2480US12284771B2Closed-cavity printed circuit boardSKYWORKS SOLUTIONS INC·Filed 2023·Granted Apr 22, 2025·0 cites·20 claims
- 2579US8207022B1Exposed die overmolded flip chip package methodDARVEAUX ROBERT FRANCIS·Filed 2011·Granted Jun 26, 2012·3 cites·20 claims
- 2678US12442651B2Apparatus, method, computer program, and computer readable recording medium for route guidanceTHINKWARE CORP·Filed 2024·Granted Oct 14, 2025·0 cites·20 claims
- 2777US12416507B2Device, method, computer program, and computer readable-recording medium for route guidanceTHINKWARE CORP·Filed 2024·Granted Sep 16, 2025·0 cites·20 claims
- 2877US2024090123A1Nested filtersSKYWORKS SOLUTIONS INC·Filed 2023·Application pending·0 cites
- 2976US12306003B2Image processing apparatus, image processing method, computer program and computer readable recording mediumTHINKWARE CORP·Filed 2024·Granted May 20, 2025·0 cites·20 claims
- 3076US7554194B2Thermally enhanced semiconductor packageAMKOR TECHNOLOGY INC·Filed 2006·Granted Jun 30, 2009·8 cites·20 claims
- 3173US11609101B2Image processing apparatus, image processing method, computer program and computer readable recording mediumTHINKWARE CORP·Filed 2021·Granted Mar 21, 2023·0 cites·20 claims
- 3273US10811341B2Semiconductor device with through-mold viaAMKOR TECHNOLOGY INC·Filed 2018·Granted Oct 20, 2020·1 cites·20 claims
- 3373US2023402338A1Electronic package with through-mold connections and related electronic assemblySKYWORKS SOLUTIONS INC·Filed 2023·Application pending·0 cites
- 3473US2023402293A1Methods for manufacturing electronic packages and electronic assembliesSKYWORKS SOLUTIONS INC·Filed 2023·Application pending·0 cites
- 3573US2023402294A1Methods for mounting an electronic package to a circuit boardSKYWORKS SOLUTIONS INC·Filed 2023·Application pending·0 cites
- 3671US4934190ASilicon-based sensorsSIEMENS BENDIX AUTOMOTIVE ELEC·Filed 1989·Granted Jun 19, 1990·25 cites·9 claims
- 3771US2024297134A1Electronic packageSKYWORKS SOLUTIONS INC·Filed 2024·Application pending·0 cites
- 3871US2024297130A1Method for manufacturing an electronic packageSKYWORKS SOLUTIONS INC·Filed 2024·Application pending·0 cites
- 3970US11765814B2Devices and methods related to nested filtersSKYWORKS SOLUTIONS INC·Filed 2019·Granted Sep 19, 2023·1 cites·5 claims
- 4070US11365979B2Image processing apparatus, image processing method, computer program and computer readable recording mediumTHINKWARE CORP·Filed 2020·Granted Jun 21, 2022·0 cites·20 claims
- 4170US7872341B1Semiconductor deviceAMKOR TECHNOLOGY INC·Filed 2009·Granted Jan 18, 2011·4 cites·20 claims
- 4269US11926951B2Apparatus for controlling motor and method for controlling motorLG ELECTRONICS INC·Filed 2021·Granted Mar 12, 2024·0 cites·11 claims
- 4369US11869829B2Semiconductor device with through-mold viaAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jan 9, 2024·0 cites·12 claims
- 4467US11920942B2Device, method, computer program, and computer readable-recording medium for route guidanceTHINKWARE CORP·Filed 2021·Granted Mar 5, 2024·0 cites·20 claims
- 4567US11736046B2Apparatus for controlling motor and method for controlling motorLG ELECTRONICS INC·Filed 2021·Granted Aug 22, 2023·0 cites·20 claims
- 4667US4870745AMethods of making silicon-based sensorsSIEMENS BENDIX AUTOMOTIVE ELEC·Filed 1987·Granted Oct 3, 1989·21 cites·9 claims
- 4766US12013250B2Apparatus, method, computer program, and computer readable recording medium for route guidanceTHINKWARE CORP·Filed 2021·Granted Jun 18, 2024·0 cites·20 claims
- 4866US11162809B2Apparatus, method, computer program, and computer readable recording medium for route guidanceTHINKWARE CORP·Filed 2017·Granted Nov 2, 2021·1 cites·20 claims
- 4965US2021399423A1Radio-frequency module with integrated conformal shield antennaSKYWORKS SOLUTIONS INC·Filed 2021·Application pending·0 cites
- 5064US2025149493A1Integrated device package with reduced thicknessSKYWORKS SOLUTIONS INC·Filed 2024·Application pending·0 cites
Showing the top 50 of 71 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →