Inventor · disambiguated record
Kingsuk Maitra
Also filed as: MAITRA KINGSUK
18 granted patents·6 pending applications·157 citations·filing 2007–2022
93Inventor score
Files withMICROSOFT TECHNOLOGY LICENSING LLC9ADVANCED MICRO DEVICES INC4GLOBALFOUNDRIES INC2IBM2WAHL JEREMY A2
Top patents by PatentIndex Score
24 records- 0197US7652332B2Extremely-thin silicon-on-insulator transistor with raised source/drainIBM·Filed 2007·Granted Jan 26, 2010·50 cites·13 claims
- 0293US7871869B2Extremely-thin silicon-on-insulator transistor with raised source/drainIBM·Filed 2009·Granted Jan 18, 2011·24 cites·7 claims
- 0391US8460984B2FIN-FET device and method and integrated circuits using suchWAHL JEREMY·Filed 2011·Granted Jun 11, 2013·23 cites·17 claims
- 0489US8900973B2Method to enable compressively strained pFET channel in a FinFET structure by implant and thermal diffusionBERLINER NATHANIEL C·Filed 2011·Granted Dec 2, 2014·14 cites·18 claims
- 0587US8669147B2Methods of forming high mobility fin channels on three dimensional semiconductor devicesPHAM DANIEL T·Filed 2012·Granted Mar 11, 2014·10 cites·23 claims
- 0685US8759904B2Electronic device having plural FIN-FETs with different FIN heights and planar FETs on the same substrateWAHL JEREMY A·Filed 2011·Granted Jun 24, 2014·10 cites·17 claims
- 0783US12314015B2Redundant machine learning architecture for high-risk environmentsMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2022·Granted May 27, 2025·1 cites·20 claims
- 0883US9219040B2Integrated circuit with semiconductor fin fuseGLOBALFOUNDRIES INC·Filed 2013·Granted Dec 22, 2015·5 cites·13 claims
- 0981US7759205B1Methods for fabricating semiconductor devices minimizing under-oxide regrowthADVANCED MICRO DEVICES INC·Filed 2009·Granted Jul 20, 2010·9 cites·18 claims
- 1080US8569116B2Integrated circuit with a fin-based fuse, and related fabrication methodMANN RANDY W·Filed 2011·Granted Oct 29, 2013·5 cites·19 claims
- 1171US10890755B2Steerable optical assembliesMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2018·Granted Jan 12, 2021·1 cites·20 claims
- 1269US8722482B2Strained silicon carbide channel for electron mobility of NMOSWAHL JEREMY A·Filed 2010·Granted May 13, 2014·2 cites·10 claims
- 1368US11656454B2Steerable optical assembliesMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2020·Granted May 23, 2023·0 cites·21 claims
- 1465US7880236B2Semiconductor circuit including a long channel device and a short channel deviceADVANCED MICRO DEVICES INC·Filed 2008·Granted Feb 1, 2011·3 cites·18 claims
- 1557US8963255B2Strained silicon carbide channel for electron mobility of NMOSGLOBALFOUNDRIES INC·Filed 2014·Granted Feb 24, 2015·0 cites·17 claims
- 1656US12189350B2Aging aware reward construct for machine teachingMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2022·Granted Jan 7, 2025·0 cites·17 claims
- 1752US12164292B2Machine learning design for long-term reliability and stress testingMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2022·Granted Dec 10, 2024·0 cites·20 claims
- 1852US2024093900A1Machine teaching with method of momentsMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2022·Application pending·0 cites
- 1950US2023266720A1Quality aware machine teaching for autonomous platformsMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2022·Application pending·0 cites
- 2045US2010038686A1Soi substrates and devices on soi substrates having a silicon nitride diffusion inhibition layer and methods for fabricatingADVANCED MICRO DEVICES INC·Filed 2008·Application pending·0 cites
- 2144US2022113049A1Autonomous control of supervisory setpoints using artificial intelligenceMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2020·Application pending·0 cites
- 2243US9495491B2Reliability aware thermal designMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2014·Granted Nov 15, 2016·0 cites·20 claims
- 2342US2009045458A1Mos transistors for thin soi integration and methods for fabricating the sameADVANCED MICRO DEVICES INC·Filed 2007·Application pending·0 cites
- 2436US2012070947A1Inducing stress in fin-fet deviceBASKER VEERARAGHAVAN S·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →