Inventor · disambiguated record
Kimihiko Nakatani
Also filed as: NAKATANI KIMIHIKO
50 granted patents·38 pending applications·46 citations·filing 2014–2025
97Inventor score
Top patents by PatentIndex Score
88 records- 0196US11527402B2Method of processing substrate, substrate processing apparatus, recording medium, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Dec 13, 2022·4 cites·20 claims
- 0296US11417518B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Aug 16, 2022·4 cites·20 claims
- 0396US11158501B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Oct 26, 2021·4 cites·20 claims
- 0494US11923193B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Mar 5, 2024·3 cites·22 claims
- 0593US11935742B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Mar 19, 2024·1 cites·21 claims
- 0690US11626280B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Apr 11, 2023·1 cites·19 claims
- 0788US11837466B2Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Dec 5, 2023·1 cites·22 claims
- 0887US11746416B2Method of processing substrate and manufacturing semiconductor device by forming film containing siliconKOKUSAI ELECTRIC CORP·Filed 2018·Granted Sep 5, 2023·3 cites·19 claims
- 0987US9187826B2Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Nov 17, 2015·6 cites·19 claims
- 1086US12400874B2Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Aug 26, 2025·0 cites·23 claims
- 1186US11923191B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Mar 5, 2024·1 cites·20 claims
- 1286US9558937B2Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Jan 31, 2017·4 cites·20 claims
- 1385US12494364B2Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Dec 9, 2025·0 cites·21 claims
- 1485US12283478B2Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Granted Apr 22, 2025·0 cites·21 claims
- 1585US9728409B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Granted Aug 8, 2017·4 cites·10 claims
- 1685US2025285878A1Apparatus for etching baseKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1783US9916976B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Mar 13, 2018·4 cites·12 claims
- 1883US2025336670A1Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1982US12278103B2Method of processing substrate and method of manufacturing semiconductor device by forming filmKOKUSAI ELECTRIC CORP·Filed 2023·Granted Apr 15, 2025·0 cites·22 claims
- 2081US12374544B2Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
- 2181US12281386B2Method of processing substrate for forming film containing silicon by supplying precursor containing Si—C bondsKOKUSAI ELECTRIC CORP·Filed 2023·Granted Apr 22, 2025·0 cites·21 claims
- 2281US2025226204A1Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 2380US11335554B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted May 17, 2022·1 cites·18 claims
- 2480US11183382B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Nov 23, 2021·2 cites·21 claims
- 2580US2025391678A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing system, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 2678US11894239B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Feb 6, 2024·0 cites·21 claims
- 2777US2025270694A1Processing apparatus, processing method, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 2876US2025069891A1Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2975US2025246427A1Processing apparatus, processing method, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 3075US2025283215A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 3173US12381091B2Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Granted Aug 5, 2025·0 cites·21 claims
- 3273US12331393B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Jun 17, 2025·0 cites·23 claims
- 3373US11315800B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Apr 26, 2022·0 cites·19 claims
- 3472US12033852B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Jul 9, 2024·0 cites·20 claims
- 3571US12424463B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing system, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Sep 23, 2025·0 cites·19 claims
- 3671US12255072B2Method of processing substrate, substrate processing apparatus, recording medium, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Mar 18, 2025·0 cites·20 claims
- 3771US11978623B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted May 7, 2024·0 cites·23 claims
- 3871US11848203B2Methods of processing substrate and manufacturing semiconductor device by forming film, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Dec 19, 2023·0 cites·24 claims
- 3970US9953830B2Method of manufacturing semiconductor device, substrate processing apparatus and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Apr 24, 2018·2 cites·12 claims
- 4069US2025218790A1Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 4169US2025218786A1Method of processing substrate, substrate processing apparatus, recording medium, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 4268US12243753B2Method and apparatus for selective film formation in semiconductor substrate processingKOKUSAI ELECTRIC CORP·Filed 2021·Granted Mar 4, 2025·0 cites·22 claims
- 4367US12176216B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Dec 24, 2024·0 cites·8 claims
- 4467US11699593B2Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jul 11, 2023·0 cites·20 claims
- 4567US2025379060A1Etching method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 4665US10276393B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2015·Granted Apr 30, 2019·1 cites·14 claims
- 4763US2025218770A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 4863US2025210345A1Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 4960US12080550B2Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Sep 3, 2024·0 cites·21 claims
- 5060US2024287676A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
Showing the top 50 of 88 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →