Inventor · disambiguated record
Ki Myung Nam
Also filed as: NAM KI MYUNG
19 granted patents·4 pending applications·15 citations·filing 2009–2017
90Inventor score
Top patents by PatentIndex Score
23 records- 0182US8921879B2Optical device and method for manufacturing sameNAM KI MYUNG·Filed 2011·Granted Dec 30, 2014·6 cites·23 claims
- 0280US9559268B2Method for manufacturing optical element for backlight unit and optical element and optical element array manufactured by methodPOINT ENGINEERING CO LTD·Filed 2015·Granted Jan 31, 2017·3 cites·4 claims
- 0370US9374890B2Chip substrate having a lens insertPOINT ENGINEERING CO LTD·Filed 2014·Granted Jun 21, 2016·1 cites·7 claims
- 0468US9281452B2Method for manufacturing a can package-type optical device, and optical device manufactured therebyPOINT ENGINEERING CO LTD·Filed 2012·Granted Mar 8, 2016·2 cites·6 claims
- 0568US9018651B2Optical device integrated with driving circuit and power supply circuit, method for manufacturing optical device substrate used therein, and substrate thereofPOINT ENGINEERING CO LTD·Filed 2012·Granted Apr 28, 2015·2 cites·11 claims
- 0662US9378986B2Method for mounting a chip and chip packagePOINT ENGINEERING CO LTD·Filed 2014·Granted Jun 28, 2016·1 cites·3 claims
- 0755US9316768B2Substrate for preventing burr generationPOINT ENGINEERING CO LTD·Filed 2014·Granted Apr 19, 2016·0 cites·8 claims
- 0855US9287243B2Optical device and method for manufacturing samePOINT ENGINEERING CO LTD·Filed 2013·Granted Mar 15, 2016·0 cites·27 claims
- 0953US9666565B2Optical device and method for manufacturing samePOINT ENGINEERING CO LTD·Filed 2016·Granted May 30, 2017·0 cites·1 claims
- 1052US9214453B2Optical device and method for manufacturing samePOINT ENGINEERING CO LTD·Filed 2015·Granted Dec 15, 2015·0 cites·2 claims
- 1151US10008638B2Method for manufacturing optical element for backlight unit and optical element and optical element array manufactured by methodPOINT ENGINEERING CO LTD·Filed 2013·Granted Jun 26, 2018·0 cites·2 claims
- 1248US10062812B2Substrate for can package-type optical device and optical device using samePOINT ENGINEERING CO LTD·Filed 2015·Granted Aug 28, 2018·0 cites·4 claims
- 1347US9847462B2Array substrate for mounting chip and method for manufacturing the samePOINT ENGINEERING CO LTD·Filed 2014·Granted Dec 19, 2017·0 cites·3 claims
- 1447US9537074B2High heat-radiant optical device substratePOINT ENGINEERING CO LTD·Filed 2015·Granted Jan 3, 2017·0 cites·1 claims
- 1547US9306142B2High heat-radiant optical device substrate and manufacturing method thereofNAM KI MYUNG·Filed 2011·Granted Apr 5, 2016·0 cites·18 claims
- 1646US2011278624A1Substrate for an optical device, an optical device package comprising the same and a production method for the sameNAM KI MYUNG·Filed 2009·Application pending·0 cites
- 1745US9818913B2Chip substratePOINT ENGINEERING CO LTD·Filed 2017·Granted Nov 14, 2017·0 cites·6 claims
- 1844US2014177242A1Substrate for Optical DeviceNAM KI MYUNG·Filed 2012·Application pending·0 cites
- 1942US2015243864A1Method for Manufacturing Optical Device and Optical Device Manufactured by SamePOINT ENGINEERING CO LTD·Filed 2013·Application pending·0 cites
- 2041US9666558B2Substrate for mounting a chip and chip package using the substratePOINT ENGINEERING CO LTD·Filed 2015·Granted May 30, 2017·0 cites·12 claims
- 2141US9595642B2Chip substrate comprising a plated layer and chip package using the samePOINT ENGINEERING CO LTD·Filed 2015·Granted Mar 14, 2017·0 cites·9 claims
- 2240US2014225135A1Optical Device Array Substrate Having a Heat Dissipating Structure Integrated with a Substrate, and Method for Manufacturing SamePOINT ENGINEERING CO LTD·Filed 2012·Application pending·0 cites
- 2336US9653664B2Chip substrate comprising a groove portion and chip package using the chip substratePOINT ENGINEERING CO LTD·Filed 2015·Granted May 16, 2017·0 cites·12 claims
Join the waitlist — get patent alerts
Get an alert when Ki Myung Nam files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →