Inventor · disambiguated record
Kiyoshi Oi
Also filed as: OI KIYOSHI
29 granted patents·8 pending applications·233 citations·filing 2005–2024
96Inventor score
Top patents by PatentIndex Score
37 records- 0195US9859201B2Wiring substrate, semiconductor device, and method for manufacturing wiring substrateSHINKO ELECTRIC IND CO·Filed 2015·Granted Jan 2, 2018·18 cites·9 claims
- 0294US7319049B2Method of manufacturing an electronic parts packaging structureSHINKO ELECTRIC IND CO·Filed 2005·Granted Jan 15, 2008·40 cites·19 claims
- 0393US7536780B2Method of manufacturing wiring substrate to which semiconductor chip is mountedSHINKO ELECTRIC IND CO·Filed 2005·Granted May 26, 2009·30 cites·8 claims
- 0489US8669653B2Semiconductor device having electronic component in through part, electronic device, and manufacturing method of semiconductorOI KIYOSHI·Filed 2010·Granted Mar 11, 2014·14 cites·12 claims
- 0588US11817381B2Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2021·Granted Nov 14, 2023·2 cites·13 claims
- 0688US9307641B2Wiring substrate and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2015·Granted Apr 5, 2016·6 cites·7 claims
- 0786US9997450B2Wiring substrate and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2016·Granted Jun 12, 2018·6 cites·8 claims
- 0886US8334461B2Wiring board and electronic component deviceTAGUCHI YUICHI·Filed 2008·Granted Dec 18, 2012·14 cites·8 claims
- 0986US7414309B2Encapsulated electronic part packaging structureSHINKO ELECTRIC IND CO·Filed 2006·Granted Aug 19, 2008·12 cites·6 claims
- 1085US8720519B2Electronic packaging apparatus and electronic packaging methodYAMAKAMI TAKATOYO·Filed 2011·Granted May 13, 2014·9 cites·7 claims
- 1183US7928557B2Stacked package and method for manufacturing the packageSHINKO ELECTRIC IND CO·Filed 2007·Granted Apr 19, 2011·12 cites·9 claims
- 1278US9530744B2Semiconductor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2014·Granted Dec 27, 2016·4 cites·6 claims
- 1378US7678612B2Method of manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2007·Granted Mar 16, 2010·8 cites·8 claims
- 1478US7284307B2Method for manufacturing wiring boardSHINKO ELECTRIC IND CO·Filed 2005·Granted Oct 23, 2007·6 cites·12 claims
- 1578US7229856B2Method of manufacturing electronic part packaging structureSHINKO ELECTRIC IND CO·Filed 2005·Granted Jun 12, 2007·7 cites·9 claims
- 1677US7375022B2Method of manufacturing wiring boardSHINKO ELECTRIC IND CO·Filed 2005·Granted May 20, 2008·8 cites·10 claims
- 1776US7403370B2Capacitor partsSHINKO ELECTRIC IND CO·Filed 2005·Granted Jul 22, 2008·8 cites·10 claims
- 1874US9622347B2Wiring substrate, semiconductor device, method of manufacturing wiring substrate, and method of manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2014·Granted Apr 11, 2017·3 cites·4 claims
- 1973US8111954B2Module substrate including optical transmission mechanism and method of producing the sameKOIZUMI NAOYUKI·Filed 2009·Granted Feb 7, 2012·6 cites·12 claims
- 2072US7358591B2Capacitor device and semiconductor device having the same, and capacitor device manufacturing methodSHINKO ELECTRIC IND CO·Filed 2005·Granted Apr 15, 2008·5 cites·9 claims
- 2171US7678681B2Electronic component built-in substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2007·Granted Mar 16, 2010·4 cites·9 claims
- 2270US8017503B2Manufacturing method of semiconductor packageSHINKO ELECTRIC IND CO·Filed 2010·Granted Sep 13, 2011·3 cites·10 claims
- 2367US9048331B2Method of manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2013·Granted Jun 2, 2015·2 cites·10 claims
- 2464US7859121B2Wiring board and method of manufacturing the same, and electronic component device using the wiring board and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2008·Granted Dec 28, 2010·2 cites·5 claims
- 2563US2025113438A1Wiring board and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2024·Application pending·0 cites
- 2662US7768140B2Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2007·Granted Aug 3, 2010·2 cites·11 claims
- 2760US8138018B2Manufacturing method of semiconductor device having underfill resin formed without void between semiconductor chip and wiring boardOI KIYOSHI·Filed 2009·Granted Mar 20, 2012·2 cites·5 claims
- 2858US12185470B2Embedded printed circuit boardSHINKO ELECTRIC IND CO·Filed 2023·Granted Dec 31, 2024·0 cites·9 claims
- 2954US11706877B2Composite wiring substrate and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2022·Granted Jul 18, 2023·0 cites·14 claims
- 3051US2009121341A1Component for semiconductor package and manufacturing method of component for semiconductor packageSHINKO ELECTRIC IND CO·Filed 2008·Application pending·0 cites
- 3149US2019391069A1Flow cellSHINKO ELECTRIC IND CO·Filed 2019·Application pending·0 cites
- 3247US7963031B2Package for semiconductor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2008·Granted Jun 21, 2011·0 cites·5 claims
- 3347US2007111387A1Manufacturing method of wiring board and manufacturing method of semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2006·Application pending·0 cites
- 3447US2009121334A1Manufacturing method of semiconductor apparatus and semiconductor apparatusSHINKO ELECTRIC IND CO·Filed 2008·Application pending·0 cites
- 3544US2010267208A1Component for semiconductor package and manufacturing method of component for semiconductor packageSHINKO ELECTRIC IND CO·Filed 2010·Application pending·0 cites
- 3644US2008303153A1Semiconductor device, manufacturing method thereof, and semiconductor device productSHINKO ELECTRIC IND CO·Filed 2008·Application pending·0 cites
- 3740US2006017133A1Electronic part-containing elements, electronic devices and production methodsSHINKO ELECTRIC IND CO·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →