Inventor · disambiguated record
Kim Phillippe
Also filed as: PHILLIPPE KIM L
1 granted patent·1 pending application·65 citations·filing 2002–2005
52Inventor score
Technology areasH10W
Files withINTEL CORP2
Top patents by PatentIndex Score
2 records- 0188US6867978B2Integrated heat spreader package for heat transfer and for bond line thickness control and process of makingINTEL CORP·Filed 2002·Granted Mar 15, 2005·65 cites·14 claims
- 0241US2005157471A1Integrated heat spreader package for heat transfer and for bond line thickness control and process of makingINTEL CORP·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →