Integrated heat spreader package for heat transfer and for bond line thickness control and process of making

Abstract

A system includes a thermal interface material (TIM) to transfer heat from a die to a heat spreader. The system includes a heat transfer subsystem disposed on the backside surface of the die. In one embodiment, the heat transfer subsystem comprises a first heat transfer material and a second heat transfer material discretely disposed within the first heat transfer material. A method of bonding a die to a heat spreader uses a die-referenced process as opposed to a substrate-referenced process.

1 - 9 . (canceled)  
   
   
       10 . An integrated heat spreader system comprising: 
 a heat spreader body having a recess;    an interface subsystem in the recess, wherein the interface subsystem is selected from (1) a first heat transfer material, (2) the first heat transfer material and a second heat transfer material discretely disposed within the first heat transfer material, and (3) the second heat transfer material alone having a discrete patterning within the recess.    
   
   
       11 - 13 . (canceled)  
   
   
       14 . The integrated heat spreader system according to  claim 10 , wherein the first heat transfer material includes an organic-inorganic composite.  
   
   
       15 . The integrated heat spreader system according to  claim 10 , wherein the first heat transfer material further includes: 
 an organic-inorganic composite including a polymer or a resin;    optionally an inorganic dielectric; and    optionally at least one metallic.    
   
   
       16 - 18 . (canceled)  
   
   
       19 . A thermal interface comprising: 
 a first heat transfer material, selected from a low melting point solder, a polymer, a polymer and a low melting point solder, a polymer and an inorganic dielectric, and a polymer and a low melting-point solder and an inorganic dielectric; and 
 a high melting-point solder second heat transfer material, discretely disposed within the first heat transfer material, wherein the high melting-point solder second heat transfer material has a higher thermal conductivity than the first heat transfer material.  
   
   
   
       20 . The thermal interface according to  claim 19 , wherein the high melting point solder second heat transfer material includes at least one solder island that has a characteristic thickness in a range from about 0.1 micron to about 25 micron.  
   
   
       21 . (canceled)  
   
   
       22 . The thermal interface according to  claim 19 , further including: 
 an integrated heat spreader, wherein the thermal interface is on the integrated heat spreader.    
   
   
       23 . (canceled)  
   
   
       24 . The thermal interface according to  claim 19 , wherein the first heat transfer material is a low melting point solder, and the high melting-point solder second heat transfer material is present in a volume range from about 0% to about 5%.  
   
   
       25 . A packaging process comprising: 
 coupling a thermal management device to a die through an interface subsystem, 
 wherein the thermal management device is selected from 
 an integrated heat spreader,  
 a heat pipe, and  
 a planar heat sink, and  
 
 wherein the interface subsystem is selected from 
 a first heat transfer material, and  
 the first heat transfer material and a second heat transfer material discretely disposed within the first heat transfer material, wherein the first heat transfer material has either a first melting temperature or a first curing temperature, and the second heat transfer material has a second melting temperature higher than the first temperature; and  
 
   bonding the interface subsystem to the thermal management device and the die.    
   
   
       26 . The process according to  claim 25 , wherein the first heat transfer material is selected from a low melting-point solder, an organic composition, and a combination thereof, and wherein bonding the interface subsystem includes reflowing the low melting-point solder or curing and hardening the organic composition.  
   
   
       27 . The process according to  claim 25 , wherein the first heat transfer material includes a low melting-point solder, wherein the second heat transfer material includes a high melting-point solder, and wherein bonding the interface subsystem includes reflowing the low melting-point solder.  
   
   
       28 . The process according to  claim 25 , wherein coupling the thermal management device to the die through an interface subsystem further includes: 
 disposing the first heat transfer material against the thermal management device;    disposing the second heat transfer material against the die; and    coupling the first heat transfer material and the second heat transfer material.    
   
   
       29 . The process according to  claim 25 , wherein coupling the thermal management device to the die through an interface subsystem further includes: 
 disposing the first heat transfer material and the second heat transfer material against the thermal management device; and    coupling the first heat transfer material and the second heat transfer material with the die.    
   
   
       30 . The process according to  claim 25 , wherein coupling the thermal management device to the die through an interface subsystem further includes: 
 disposing the first heat transfer material and the second heat transfer material against the die; and    coupling the first heat transfer material and the second heat transfer material with the thermal management device.