Inventor · disambiguated record
Ki Jun Sung
Also filed as: SUNG KI JUN
25 granted patents·3 pending applications·155 citations·filing 2011–2024
95Inventor score
Top patents by PatentIndex Score
28 records- 0195US9170333B2Dynamic range three-dimensional image systemMHEEN BONGKI·Filed 2011·Granted Oct 27, 2015·87 cites·18 claims
- 0293US11495545B2Semiconductor package including a bridge dieSK HYNIX INC·Filed 2020·Granted Nov 8, 2022·3 cites·10 claims
- 0389US9460990B1Substrates and semiconductor packages including the same, electronic systems including the semiconductor packages, and memory cards including the semiconductor packagesSK HYNIX INC·Filed 2015·Granted Oct 4, 2016·7 cites·23 claims
- 0488US11322446B2System-in-packages including a bridge dieSK HYNIX INC·Filed 2019·Granted May 3, 2022·5 cites·12 claims
- 0588US10658332B2Stack packages including bridge diesSK HYNIX INC·Filed 2018·Granted May 19, 2020·5 cites·20 claims
- 0687US11127296B2Apparatus and method for inducing safe driving of a surrounding vehicleHYUNDAI MOTOR CO LTD·Filed 2020·Granted Sep 21, 2021·2 cites·17 claims
- 0786US9640473B2Semiconductor packagesSK HYNIX INC·Filed 2015·Granted May 2, 2017·6 cites·19 claims
- 0884US10170456B2Semiconductor packages including heat transferring blocks and methods of manufacturing the sameSK HYNIX INC·Filed 2017·Granted Jan 1, 2019·7 cites·20 claims
- 0984US9922965B2Manufacturing methods semiconductor packages including through mold connectorsSK HYNIX INC·Filed 2017·Granted Mar 20, 2018·3 cites·11 claims
- 1083US9806015B1Semiconductor packages including through mold ball connectors on elevated pads and methods of manufacturing the sameSK HYNIX INC·Filed 2017·Granted Oct 31, 2017·4 cites·20 claims
- 1182US9324688B2Embedded packages having a connection joint groupSK HYNIX INC·Filed 2014·Granted Apr 26, 2016·6 cites·7 claims
- 1281US10643973B2Semiconductor packages including a multi-chip stackSK HYNIX INC·Filed 2018·Granted May 5, 2020·3 cites·20 claims
- 1378US10971452B2Semiconductor package including electromagnetic interference shielding layerSK HYNIX INC·Filed 2020·Granted Apr 6, 2021·1 cites·22 claims
- 1478US9847322B2Semiconductor packages including through mold ball connectors and methods of manufacturing the sameSK HYNIX INC·Filed 2017·Granted Dec 19, 2017·3 cites·14 claims
- 1578US9659910B1Manufacturing methods semiconductor packages including through mold connectorsSK HYNIX INC·Filed 2016·Granted May 23, 2017·2 cites·19 claims
- 1674US9847285B1Semiconductor packages including heat spreaders and methods of manufacturing the sameSK HYNIX INC·Filed 2017·Granted Dec 19, 2017·2 cites·14 claims
- 1774US9153557B2Chip stack embedded packagesSK HYNIX INC·Filed 2014·Granted Oct 6, 2015·3 cites·19 claims
- 1873US10903196B2Semiconductor packages including bridge dieSK HYNIX INC·Filed 2019·Granted Jan 26, 2021·3 cites·18 claims
- 1968US10903131B2Semiconductor packages including bridge die spaced apart from semiconductor dieSK HYNIX INC·Filed 2018·Granted Jan 26, 2021·1 cites·20 claims
- 2063US9837360B2Wafer level packages and electronics system including the sameSK HYNIX INC·Filed 2016·Granted Dec 5, 2017·1 cites·19 claims
- 2162US10811359B2Stack packages relating to bridge dieSK HYNIX INC·Filed 2019·Granted Oct 20, 2020·1 cites·20 claims
- 2254US2024234379A1Stack packages and methods of manufacturing the sameSK HYNIX INC·Filed 2024·Application pending·0 cites
- 2352US11804474B2Stack packages and methods of manufacturing the sameSK HYNIX INC·Filed 2021·Granted Oct 31, 2023·0 cites·8 claims
- 2451US11444063B2Semiconductor package including vertical interconnectorSK HYNIX INC·Filed 2021·Granted Sep 13, 2022·0 cites·21 claims
- 2544US10553567B2Chip stack packagesSK HYNIX INC·Filed 2018·Granted Feb 4, 2020·0 cites·20 claims
- 2644US2020328189A1Semiconductor packages including a thermal conduction network structureSK HYNIX INC·Filed 2019·Application pending·0 cites
- 2744US2020273799A1System-in-packages including a bridge dieSK HYNIX INC·Filed 2019·Application pending·0 cites
- 2839US10985106B2Stack packages including bridge diesSK HYNIX INC·Filed 2018·Granted Apr 20, 2021·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →