Inventor · disambiguated record
Klaus Mueller
Also filed as: MUELLER KLAUS · MUELLER KLAUS-DIETER
9 granted patents·4 pending applications·146 citations·filing 1999–2022
86Inventor score
Files withSIEMENS AG5INFINEON TECHNOLOGIES AG2OSRAM OLED GMBH2OSRAM OPTO SEMICONDUCTORS GMBH2AMS OSRAM INT GMBH1
Top patents by PatentIndex Score
13 records- 0187US6546350B1Configuration and parameterization system for diagnostic devices and associated methodSIEMENS AG·Filed 2000·Granted Apr 8, 2003·89 cites·16 claims
- 0276US11315898B2Method for fastening a semiconductor chip on a substrate, and electronic componentOSRAM OLED GMBH·Filed 2018·Granted Apr 26, 2022·2 cites·19 claims
- 0370US7268423B2Flexible rewiring plate for semiconductor components, and process for producing itINFINEON TECHNOLOGIES AG·Filed 2004·Granted Sep 11, 2007·12 cites·17 claims
- 0464US7853985B2Method for verifying the authentication of a manager application in a telecommunications management network operating system by means of a network element and network element suitable thereforSIEMENS AG·Filed 2005·Granted Dec 14, 2010·6 cites·7 claims
- 0563US2022208715A1Method for Fastening a Semiconductor Chip on a Substrate, and Electronic ComponentOSRAM OLED GMBH·Filed 2022·Application pending·0 cites
- 0655US6952475B1Method and arrangement for the computer-aided exchange of cryptographic keys between a first computer unit and a second computer unitSIEMENS AG·Filed 1999·Granted Oct 4, 2005·34 cites·77 claims
- 0751US2025046748A1SOLDER BONDING ON AuSn BASIS WITH LOW BONDING TEMPERATUREAMS OSRAM INT GMBH·Filed 2022·Application pending·0 cites
- 0850US6534760B2Arrangement for the temperature-compensated multi-dimensional micropositioning of mutually position-defined optical componentsPHYSIK INSTR PI GMBH & CO KG·Filed 2001·Granted Mar 18, 2003·3 cites·9 claims
- 0949US7504711B2Semiconductor substrate with strip conductors formed of carbon nanotubes and production thereofINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 17, 2009·0 cites·16 claims
- 1046US2005021251A1Analysis of the subsidence behavior of a test objectSIEMENS AG·Filed 2004·Application pending·0 cites
- 1145US11094868B2Method for producing an illumination device and illumination deviceOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2018·Granted Aug 17, 2021·0 cites·14 claims
- 1242US10978236B2Apparatus for electrically connecting at least four electrical conductorsSIEMENS AG·Filed 2016·Granted Apr 13, 2021·0 cites·11 claims
- 1342US2017222092A1Housing for an Optical Component, Assembly, Method for Producing a Housing and Method for Producing an AssemblyOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →