Method for Fastening a Semiconductor Chip on a Substrate, and Electronic Component

Abstract

In an embodiment a method includes providing a semiconductor chip, applying a solder metal layer sequence on the semiconductor chip, providing a substrate, applying a metallization layer sequence on the substrate, applying the semiconductor chip on the substrate via the solder metal layer sequence and the metallization layer sequence and heating the applied semiconductor chip on the substrate for fastening the semiconductor chip on the substrate, wherein the solder metal layer sequence includes a first metallic layer including an indium-tin alloy, a barrier layer arranged above the first metallic layer, and a second metallic layer having gold arranged between the barrier layer and the semiconductor chip, and wherein the indium-tin alloy has the following formula: InxSn1-x with 0.04≤x≤0.2.

1 . A method comprising:
 providing a semiconductor chip;   applying a solder metal layer sequence on the semiconductor chip;   providing a substrate;   applying a metallization layer sequence on the substrate;   applying the semiconductor chip on the substrate via the solder metal layer sequence and the metallization layer sequence; and   heating the applied semiconductor chip on the substrate for fastening the semiconductor chip on the substrate,   wherein the solder metal layer sequence comprises:
 a first metallic layer comprising an indium-tin alloy, 
 a barrier layer arranged above the first metallic layer, and 
 a second metallic layer comprising gold arranged between the barrier layer and the semiconductor chip, and 
 wherein the indium-tin alloy has the following formula: In x Sn 1-x  with 0.04≤x≤0.2. 
   
     
     
         2 . The method according to  claim 1 , wherein an amount of substance of the gold in the second metallic layer is greater than an amount of substance of tin in the first metallic layer. 
     
     
         3 . The method according to  claim 2 , wherein the amount of substance of the gold in the second metallic layer is at least twice as large as the amount of substance of the tin in the first metallic layer. 
     
     
         4 . The method according to  claim 1 , wherein the metallization layer sequence comprises a first layer comprising nickel arranged above the substrate. 
     
     
         5 . The method according to  claim 1 , wherein the barrier layer comprises nickel, titanium, platinum or a titanium compound. 
     
     
         6 . The method according to  claim 1 , wherein a bonding layer sequence formed between the substrate and the semiconductor chip comprises:
 a first intermetallic layer comprising indium, tin and nickel,   a second intermetallic layer comprising indium, tin and nickel, or indium, tin and titanium, or indium, tin and a titanium compound, or indium, tin and platinum, and   a third intermetallic layer comprising indium, tin and gold.   
     
     
         7 . The method according  claim 1 , wherein the metallization layer sequence comprises a first layer comprising nickel arranged above the substrate, a second layer comprising palladium arranged above the first layer, and a third layer comprising gold arranged above the second layer. 
     
     
         8 . The method according to  claim 7 , wherein applying the semiconductor chip on the substrate comprising applying the semiconductor chip such that the first metallic layer of the solder metal layer sequence is applied on the third layer of the metallization layer sequence. 
     
     
         9 . The method according to  claim 1 , wherein the barrier layer has a layer thickness between 5 nm and 200 nm inclusive. 
     
     
         10 . The method according to  claim 1 , wherein the first metallic layer has a layer thickness between 750 nm and 3 μm inclusive and wherein the second metallic layer has a layer thickness between 500 nm and 2 μm inclusive. 
     
     
         11 . The method according to  claim 1 , wherein the solder metal layer sequence comprises an oxidation protection layer comprising gold and a second barrier layer, wherein the first metallic layer is arranged above the second barrier layer, and wherein the second barrier layer is arranged above the oxidation protection layer. 
     
     
         12 . The method according to  claim 1 , wherein the semiconductor chip comprises a carrier comprising silicon. 
     
     
         13 . The method according to  claim 1 , wherein the second metallic layer comprises the indium-tin alloy of the formula In x Sn 1-x  with 0.04≤x≤0.2. 
     
     
         14 . The method according to  claim 1 , wherein the barrier layer comprises Ti y W y-1  or Ti z N z-1 , and wherein 0≤y<1 and 0≤z<1. 
     
     
         15 . The method according to  claim 1 , wherein the first metallic layer, the barrier layer and the second metallic layer are stacked above one another in the order indicated and are in direct contact to one another. 
     
     
         16 . The method according to  claim 1 , wherein the second metallic layer comprises the indium-tin alloy of the formula In x Sn 1-x  with 0.04≤x≤0.2, wherein the barrier layer comprises Ti y W y-1  or Ti z N z-1 , wherein 0≤y<1 and 0≤z<1, and wherein the first metallic layer, the barrier layer and the second metallic layer are stacked above one another in the order indicated and are in direct contact to one another. 
     
     
         17 . A method comprising:
 providing a semiconductor chip;   applying a solder metal layer sequence on the semiconductor chip;   providing a substrate;   applying a metallization layer sequence on the substrate;   applying the semiconductor chip on the substrate via the solder metal layer sequence and the metallization layer sequence; and   heating the applied semiconductor chip on the substrate for fastening the semiconductor chip on the substrate,   wherein a bonding layer sequence formed between the substrate and the semiconductor chip comprises:
 a first intermetallic layer comprising indium, tin and nickel, 
 a second intermetallic layer comprising indium, tin and nickel, or indium, tin and titanium, or indium, tin and a titanium compound, or indium, tin and platinum, and 
 a third intermetallic layer comprising indium, tin and gold, and 
   wherein the third intermetallic layer comprises a gold-tin alloy of a zeta phase.   
     
     
         18 . An electronic component comprising:
 a substrate;   a semiconductor chip arranged above the substrate; and   a bonding layer sequence arranged between the substrate and the semiconductor chip, the bonding layer sequence comprising:
 a first intermetallic layer comprising indium, tin and nickel; 
 a second intermetallic layer comprising indium, tin and a titanium compound, or indium, tin and nickel, or indium, tin and platinum, or indium, tin and titanium; and 
 a third intermetallic layer comprising indium, tin and gold, 
 wherein the third intermetallic layer comprises a gold-tin alloy of a zeta phase. 
   
     
     
         19 . The electronic component according to  claim 18 , wherein in the third intermetallic layer an amount of substance of gold is greater than an amount of substance of tin. 
     
     
         20 . The electronic component according to  claim 18 , wherein the first intermetallic layer is arranged above the substrate, the second intermetallic layer is arranged above the first intermetallic layer and the third intermetallic layer is arranged above the second intermetallic layer.