Inventor · disambiguated record
Klaus Reingruber
Also filed as: REINGRUBER KLAUS · REINGRUBER Klaus Jürgen
33 granted patents·14 pending applications·192 citations·filing 2011–2024
96Inventor score
Top patents by PatentIndex Score
47 records- 0197US11955462B2Package stacking using chip to wafer bondingINTEL CORP·Filed 2021·Granted Apr 9, 2024·3 cites·20 claims
- 0297US9646856B2Method of manufacturing a semiconductor device including removing a relief layer from back surface of semiconductor chipINTEL MOBILE COMM GMBH·Filed 2015·Granted May 9, 2017·75 cites·12 claims
- 0395US9064883B2Chip with encapsulated sides and exposed surfaceMEYER THORSTEN·Filed 2011·Granted Jun 23, 2015·41 cites·7 claims
- 0494US10170409B2Package on package architecture and method for makingGANESAN SANKA·Filed 2013·Granted Jan 1, 2019·22 cites·20 claims
- 0589US10403609B2System-in-package devices and methods for forming system-in-package devicesINTEL IP CORP·Filed 2015·Granted Sep 3, 2019·7 cites·25 claims
- 0689US10186499B2Integrated circuit package assemblies including a chip recessINTEL IP CORP·Filed 2016·Granted Jan 22, 2019·6 cites·15 claims
- 0789US9711492B2Three dimensional structures within mold compoundINTEL CORP·Filed 2014·Granted Jul 18, 2017·8 cites·20 claims
- 0887US10115668B2Semiconductor package having a variable redistribution layer thicknessINTEL IP CORP·Filed 2015·Granted Oct 30, 2018·5 cites·10 claims
- 0984US10714455B2Integrated circuit package assemblies including a chip recessINTEL IP CORP·Filed 2018·Granted Jul 14, 2020·3 cites·17 claims
- 1081US10209466B2Integrated circuit packages including an optical redistribution layerINTEL IP CORP·Filed 2016·Granted Feb 19, 2019·3 cites·17 claims
- 1181US9741651B1Redistribution layer linesINTEL IP CORP·Filed 2016·Granted Aug 22, 2017·3 cites·18 claims
- 1281US2024213225A1Package stacking using chip to wafer bondingINTEL CORP·Filed 2024·Application pending·0 cites
- 1379US10553538B2Semiconductor package having a variable redistribution layer thicknessINTEL IP CORP·Filed 2018·Granted Feb 4, 2020·2 cites·19 claims
- 1479US10522485B2Electrical device and a method for forming an electrical deviceINTEL IP CORP·Filed 2015·Granted Dec 31, 2019·3 cites·25 claims
- 1578US11239199B2Package stacking using chip to wafer bondingINTEL CORP·Filed 2015·Granted Feb 1, 2022·2 cites·18 claims
- 1677US10937932B2Optoelectronic component and method of producing an optoelectronic componentOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2019·Granted Mar 2, 2021·1 cites·9 claims
- 1775US9865387B2Electronic package with coil formed on coreINTEL IP CORP·Filed 2015·Granted Jan 9, 2018·1 cites·9 claims
- 1874US10741486B2Electronic components having three-dimensional capacitors in a metallization stackINTEL IP CORP·Filed 2016·Granted Aug 11, 2020·2 cites·25 claims
- 1969US10672731B2Wafer level package structure with internal conductive layerINTEL IP CORP·Filed 2015·Granted Jun 2, 2020·1 cites·18 claims
- 2067US10366968B2Interconnect structure for a microelectronic deviceINTEL IP CORP·Filed 2016·Granted Jul 30, 2019·1 cites·13 claims
- 2166US11469213B2Systems, methods, and apparatuses for implementing reduced height semiconductor packages for mobile electronicsINTEL CORP·Filed 2016·Granted Oct 11, 2022·1 cites·25 claims
- 2265US11424209B2Wafer level package structure with internal conductive layerINTEL CORP·Filed 2020·Granted Aug 23, 2022·0 cites·20 claims
- 2365US10490527B2Vertical wire connections for integrated circuit packageINTEL IP CORP·Filed 2015·Granted Nov 26, 2019·1 cites·22 claims
- 2464US10651102B2Interposer with conductive routing exposed on sidewallsINTEL IP CORP·Filed 2015·Granted May 12, 2020·1 cites·11 claims
- 2562US2018226185A1Electronic package with coil formed on coreINTEL IP CORP·Filed 2018·Application pending·0 cites
- 2658US10816742B2Integrated circuit packages including an optical redistribution layerINTEL IP CORP·Filed 2018·Granted Oct 27, 2020·0 cites·8 claims
- 2757US9921694B2Wearable computing deviceINTEL CORP·Filed 2014·Granted Mar 20, 2018·0 cites·4 claims
- 2854US2019333886A1Interconnect structure for a microelectronic deviceINTEL IP CORP·Filed 2019·Application pending·0 cites
- 2953US10680147B2Method of producing a lighting deviceOSRAM OLED GMBH·Filed 2018·Granted Jun 9, 2020·0 cites·20 claims
- 3053US2018150156A1Wearable computing deviceINTEL CORP·Filed 2018·Application pending·0 cites
- 3152US11715820B2Optoelectronic component and method for producing an optoelectronic componentOSRAM OLED GMBH·Filed 2019·Granted Aug 1, 2023·0 cites·15 claims
- 3249US10228725B2Flexible band wearable electronic deviceINTEL IP CORP·Filed 2016·Granted Mar 12, 2019·0 cites·18 claims
- 3349US2017278778A1Microelectronic interconnect adaptorINTEL CORP·Filed 2017·Application pending·0 cites
- 3449US2018068939A1Redistribution layer linesINTEL IP CORP·Filed 2017·Application pending·0 cites
- 3547US10411000B2Microelectronic package with illuminated backside exteriorINTEL IP CORP·Filed 2016·Granted Sep 10, 2019·0 cites·20 claims
- 3646US2016329272A1Stacked semiconductor device package with improved interconnect bandwidthINTEL IP CORP·Filed 2014·Application pending·0 cites
- 3745US2016240435A1Microelectronic interconnect adaptorINTEL CORP·Filed 2015·Application pending·0 cites
- 3844US10854590B2Semiconductor die package with more than one hanging dieINTEL IP CORP·Filed 2015·Granted Dec 1, 2020·0 cites·23 claims
- 3942US10446541B2Advanced node cost reduction by ESD interposerINTEL IP CORP·Filed 2015·Granted Oct 15, 2019·0 cites·23 claims
- 4040US11670745B2Method for producing optoelectronic semiconductor components, and optoelectronic semiconductor componentOSRAM OLED GMBH·Filed 2018·Granted Jun 6, 2023·0 cites·17 claims
- 4140US10121726B2Cooler for semiconductor devicesINTEL IP CORP·Filed 2015·Granted Nov 6, 2018·0 cites·23 claims
- 4237US2019393191A1Packages of stacking integrated circuitsINTEL IP CORP·Filed 2016·Application pending·0 cites
- 4337US2020068711A1Component terminations for semiconductor packagesINTEL IP CORP·Filed 2016·Application pending·0 cites
- 4437US2020066692A1Package devices having a ball grid array with side wall contact padsINTEL IP CORP·Filed 2016·Application pending·0 cites
- 4535US2019206833A1Eplb/ewlb based pop for hbm or customized package stackINTEL IP CORP·Filed 2015·Application pending·0 cites
- 4635US2019121041A1Optical fiber connection on package edgeINTEL IP CORP·Filed 2016·Application pending·0 cites
- 4733US2018095426A1Flexible band wearable electronic deviceALBERS SVEN·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →