Inventor · disambiguated record
Klaus Schiess
Also filed as: SCHIESS KLAUS
76 granted patents·9 pending applications·322 citations·filing 2006–2023
99Inventor score
Files withINFINEON TECHNOLOGIES AG33INFINEON TECHNOLOGIES AUSTRIA AG30INFINEON TECHNOLOGIES AUSTRIA12OTREMBA RALF6BURKART HARALD1
Top patents by PatentIndex Score
85 records- 0195US7799614B2Method of fabricating a power electronic deviceINFINEON TECHNOLOGIES AG·Filed 2007·Granted Sep 21, 2010·30 cites·22 claims
- 0295US7569920B2Electronic component having at least one vertical semiconductor power transistorINFINEON TECHNOLOGIES AG·Filed 2006·Granted Aug 4, 2009·40 cites·30 claims
- 0393US7479691B2Power semiconductor module having surface-mountable flat external contacts and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jan 20, 2009·31 cites·23 claims
- 0490US8507320B2Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereofOTREMBA RALF·Filed 2008·Granted Aug 13, 2013·17 cites·10 claims
- 0590US7759777B2Semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jul 20, 2010·20 cites·7 claims
- 0689US9881862B1Top side cooling for GaN power deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Jan 30, 2018·6 cites·20 claims
- 0789US8030131B2Semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2009·Granted Oct 4, 2011·17 cites·13 claims
- 0887US9443787B2Electronic component and methodINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2013·Granted Sep 13, 2016·7 cites·16 claims
- 0986US9048838B2Switching circuitINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Jun 2, 2015·7 cites·29 claims
- 1085US10566260B2SMD package with top side coolingINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2018·Granted Feb 18, 2020·4 cites·19 claims
- 1185US9099454B2Molded semiconductor package with backside die metallizationINFINEON TECHNOLOGIES AG·Filed 2013·Granted Aug 4, 2015·8 cites·22 claims
- 1285US7701054B2Power semiconductor module and method for its manufactureINFINEON TECHNOLOGIES AG·Filed 2007·Granted Apr 20, 2010·13 cites·17 claims
- 1383US9478484B2Semiconductor packages and methods of formation thereofINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2012·Granted Oct 25, 2016·7 cites·24 claims
- 1483US9373566B2High power electronic component with multiple leadframesINFINEON TECHNOLOGIES AUSTRIA·Filed 2014·Granted Jun 21, 2016·6 cites·18 claims
- 1582US9812373B2Semiconductor package with top side cooling heat sink thermal pathwayINFINEON TECHNOLOGIES AG·Filed 2015·Granted Nov 7, 2017·4 cites·15 claims
- 1682US7928553B2Power electronic deviceINFINEON TECHNOLOGIES AG·Filed 2010·Granted Apr 19, 2011·5 cites·13 claims
- 1781US11081455B2Semiconductor device with bond pad extensions formed on molded appendageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Aug 3, 2021·4 cites·14 claims
- 1881US7807504B2Semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2009·Granted Oct 5, 2010·7 cites·8 claims
- 1981US7728415B2Power semiconductor component stack using lead technology with surface-mountable external contacts and a method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jun 1, 2010·10 cites·14 claims
- 2080US11676881B2Semiconductor package, semiconductor assembly and method for fabricating a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jun 13, 2023·1 cites·20 claims
- 2180US8952545B2Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2013·Granted Feb 10, 2015·4 cites·10 claims
- 2278US9368435B2Electronic componentINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jun 14, 2016·4 cites·26 claims
- 2378US9147631B2Semiconductor power device having a heat sinkINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Sep 29, 2015·4 cites·18 claims
- 2478US7879652B2Semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2007·Granted Feb 1, 2011·6 cites·11 claims
- 2577US11923276B2Semiconductor device including a bidirectional switchINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Granted Mar 5, 2024·0 cites·10 claims
- 2676US9952273B2Compound semiconductor device including a sensing leadINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Apr 24, 2018·2 cites·19 claims
- 2775US8129225B2Method of manufacturing an integrated circuit moduleLANDAU STEFAN·Filed 2007·Granted Mar 6, 2012·7 cites·25 claims
- 2874US10290566B2Electronic componentINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2014·Granted May 14, 2019·3 cites·18 claims
- 2973US9082759B2Semiconductor packages and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2012·Granted Jul 14, 2015·3 cites·34 claims
- 3072US11605577B2Semiconductor device including a bidirectional switchINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Mar 14, 2023·0 cites·5 claims
- 3172US10204845B2Semiconductor chip package having a repeating footprint patternINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Granted Feb 12, 2019·2 cites·20 claims
- 3271US10698021B2Device including a compound semiconductor chipINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2018·Granted Jun 30, 2020·1 cites·11 claims
- 3371US9735078B2Device including multiple semiconductor chips and multiple carriersINFINEON TECHNOLOGIES AG·Filed 2014·Granted Aug 15, 2017·2 cites·13 claims
- 3471US7955901B2Method for producing a power semiconductor module comprising surface-mountable flat external contactsINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jun 7, 2011·6 cites·25 claims
- 3570US8896106B2Semiconductor packages having multiple lead frames and methods of formation thereofOTREMBA RALF·Filed 2012·Granted Nov 25, 2014·2 cites·20 claims
- 3669US10755999B2Multi-package top-side-coolingINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Aug 25, 2020·1 cites·20 claims
- 3769US9184066B2Chip arrangements and methods for manufacturing a chip arrangementINFINEON TECHNOLOGIES AG·Filed 2012·Granted Nov 10, 2015·2 cites·33 claims
- 3867US9196554B2Electronic component, arrangement and methodINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Nov 24, 2015·2 cites·18 claims
- 3967US9196577B2Semiconductor packaging arrangementINFINEON TECHNOLOGIES AG·Filed 2014·Granted Nov 24, 2015·2 cites·20 claims
- 4067US9099441B2Power transistor arrangement and method for manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Aug 4, 2015·2 cites·15 claims
- 4167US7656033B2Semiconductor device with a semiconductor chip using lead technology and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Feb 2, 2010·4 cites·10 claims
- 4266US10074597B2Interdigit device on leadframe for evenly distributed current flowINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2017·Granted Sep 11, 2018·1 cites·20 claims
- 4366US9748166B2Semiconductor devices including control and load leads of opposite directionsINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Aug 29, 2017·1 cites·26 claims
- 4466US9230880B2Electronic device and method for fabricating an electronic deviceINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jan 5, 2016·1 cites·20 claims
- 4566US8084816B2Semiconductor moduleOTREMBA RALF·Filed 2009·Granted Dec 27, 2011·2 cites·13 claims
- 4665US7851927B2Semiconductor component comprising a semiconductor chip and semiconductor component carrier with external connection stripsINFINEON TECHNOLOGIES AG·Filed 2007·Granted Dec 14, 2010·3 cites·34 claims
- 4763US9899481B2Electronic component and switch circuitINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Feb 20, 2018·1 cites·17 claims
- 4863US9525063B2Switching circuitINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2013·Granted Dec 20, 2016·1 cites·20 claims
- 4963US9362240B2Electronic deviceINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Jun 7, 2016·1 cites·14 claims
- 5063US8441804B2Semiconductor device and method of manufacturing a semiconductor deviceHAEBERLEN OLIVER·Filed 2008·Granted May 14, 2013·2 cites·23 claims
Showing the top 50 of 85 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →