Inventor · disambiguated record
Koichi Araki
Also filed as: ARAKI KOICHI
3 granted patents·181 citations·filing 1994–1996
77Inventor score
Files withTOWA CORP3
Top patents by PatentIndex Score
3 records- 0187US5834035AMethod of and apparatus for molding resin to seal electronic partsTOWA CORP·Filed 1996·Granted Nov 10, 1998·91 cites·13 claims
- 0275US5753538AMethod of sealing electronic parts with molded resin and mold employed thereforTOWA CORP·Filed 1995·Granted May 19, 1998·42 cites·26 claims
- 0375US5603879AMethod of molding resin to seal electronic parts using two evacuation stepsTOWA CORP·Filed 1994·Granted Feb 18, 1997·48 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →