Inventor · disambiguated record
Koichi Ayama
Also filed as: AYAMA KOICHI
10 granted patents·120 citations·filing 1988–2014
88Inventor score
Top patents by PatentIndex Score
10 records- 0180US8987358B2Compound including organopolysiloxane or silsesquioxane skeleton having isocyanuric skeleton, epoxy group and SiH group, thermosetting resin composition containing the compound as adhesion-imparting agent, hardened material and sealing agent for optical semiconductorKAWABATA KIICHI·Filed 2012·Granted Mar 24, 2015·5 cites·10 claims
- 0278US5831110AFluorine-containing siloxane compound and process for production thereofCHISSO CORP·Filed 1998·Granted Nov 3, 1998·27 cites·5 claims
- 0377US4937304ANew polysilazane and process for production of the sameCHISSO CORP·Filed 1988·Granted Jun 26, 1990·25 cites·7 claims
- 0475US9512273B2Thermosetting resin compositionJNC CORP·Filed 2013·Granted Dec 6, 2016·1 cites·11 claims
- 0573US6107505AProcess for production of polyorganosiloxaneCHISSO CORP·Filed 1998·Granted Aug 22, 2000·26 cites·5 claims
- 0669US9593240B2Thermosetting resin compositionJNC CORP·Filed 2013·Granted Mar 14, 2017·2 cites·14 claims
- 0768US9115243B2Organosilicon compound, thermosetting resin composition containing the organosilicon compound, hardening resin and encapsulation material for optical semiconductorJNC CORP·Filed 2014·Granted Aug 25, 2015·1 cites·9 claims
- 0866US5952444APolyurethane coating resin compositionCHISSO CORP·Filed 1997·Granted Sep 14, 1999·25 cites·15 claims
- 0945US6107504AEster group-containing siloxane compound, and its preparation methodCHISSO CORP·Filed 1998·Granted Aug 22, 2000·8 cites·14 claims
- 1035US8946357B2Organosilicon compound, thermosetting resin composition containing the organosilicon compound, hardening resin and encapsulation material for optical semiconductorKAWABATA KIICHI·Filed 2011·Granted Feb 3, 2015·0 cites·9 claims
Join the waitlist — get patent alerts
Get an alert when Koichi Ayama files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →