Inventor · disambiguated record
Kow-Bao Chen
Also filed as: CHEN KOW-BAO
1 granted patent·2 pending applications·3 citations·filing 2003–2005
24Inventor score
Files withUNITED MICROELECTRONICS CORP1
Top patents by PatentIndex Score
3 records- 0156US7008818B2Flip chip packaging process employing improved probe tip designUNITED MICROELECTRONICS CORP·Filed 2005·Granted Mar 7, 2006·3 cites·8 claims
- 0232US2005002167A1Microelectronic packageFiled 2003·Application pending·0 cites
- 0325US2005032229A1Probe tip design applied in a flip chip packaging processFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →