Inventor · disambiguated record
Koji Ebara
Also filed as: EBARA KOJI
7 granted patents·7 pending applications·29 citations·filing 2000–2020
77Inventor score
Top patents by PatentIndex Score
14 records- 0176US6589336B1Production method for silicon epitaxial wafer and silicon epitaxial waferSHINETSU HANDOTAI KK·Filed 2000·Granted Jul 8, 2003·23 cites·22 claims
- 0262US8377202B2Method for manufacturing silicon wafer and silicon wafer manufactured by this methodSHINETSU HANDOTAI KK·Filed 2007·Granted Feb 19, 2013·2 cites·20 claims
- 0350US7839426B2Time recorderSEIKO PRECISION KK·Filed 2008·Granted Nov 23, 2010·0 cites·5 claims
- 0445US6914442B2Method for measuring resistivity of semiconductor waferSHINETSU HANDOTAI KK·Filed 2003·Granted Jul 5, 2005·4 cites·1 claims
- 0543US2011001219A1Silicon single crystal wafer, method for producing silicon single crystal or method for producing silicon single crystal wafer, and semiconductor deviceSHINETSU HANDOTAI KK·Filed 2009·Application pending·0 cites
- 0643US2022146444A1Method for measuring resistivity of silicon single crystalSHINETSU HANDOTAI KK·Filed 2020·Application pending·0 cites
- 0740US10297463B2Method for manufacturing silicon waferSHINETSU HANDOTAI KK·Filed 2016·Granted May 21, 2019·0 cites·7 claims
- 0840US2009000535A1Method For Manufacturing Silicon Single Crystal WaferSHINETSU HANDOTAI KK·Filed 2006·Application pending·0 cites
- 0940US2009007839A1Method for Manufacturing Silicon Single Crystal WaferSHINETSU HANDOTAI KK·Filed 2006·Application pending·0 cites
- 1038US9252025B2Method for manufacturing silicon single crystal wafer and electronic deviceSHINETSU HANDOTAI KK·Filed 2012·Granted Feb 2, 2016·0 cites·11 claims
- 1137US9390905B2Method for manufacturing silicon substrate and silicon substrateOKA TETSUYA·Filed 2012·Granted Jul 12, 2016·0 cites·4 claims
- 1235US2013098888A1Method for heat-treating wafer, method for producing silicon wafer, silicon wafer, and heat treatment apparatusEBARA KOJI·Filed 2011·Application pending·0 cites
- 1333US2012001301A1Annealed wafer, method for producing annealed wafer and method for fabricating deviceEBARA KOJI·Filed 2010·Application pending·0 cites
- 1431US2013093060A1Method for producing silicon wafer and silicon waferOKA TETSUYA·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →