Inventor · disambiguated record
Kousik Ganesan
Also filed as: GANESAN KOUSIK
14 granted patents·4 pending applications·239 citations·filing 2007–2020
93Inventor score
Top patents by PatentIndex Score
18 records- 0198US8262871B1Plating method and apparatus with multiple internally irrigated chambersMAYER STEVEN T·Filed 2009·Granted Sep 11, 2012·55 cites·21 claims
- 0297US8377268B2Electroplating cup assemblyNOVELLUS SYSTEMS INC·Filed 2011·Granted Feb 19, 2013·19 cites·23 claims
- 0397US7985325B2Closed contact electroplating cup assemblyNOVELLUS SYSTEMS INC·Filed 2007·Granted Jul 26, 2011·36 cites·24 claims
- 0497US7935231B2Rapidly cleanable electroplating cup assemblyNOVELLUS SYSTEMS INC·Filed 2007·Granted May 3, 2011·36 cites·24 claims
- 0593US8398831B2Rapidly cleanable electroplating cup sealGHONGADI SHANTINATH·Filed 2011·Granted Mar 19, 2013·18 cites·27 claims
- 0692US8172992B2Wafer electroplating apparatus for reducing edge defectsPRABHAKAR VINAY·Filed 2009·Granted May 8, 2012·21 cites·26 claims
- 0789US9685353B2Apparatus and method for edge bevel removal of copper from silicon wafersNOVELLUS SYSTEMS INC·Filed 2013·Granted Jun 20, 2017·8 cites·22 claims
- 0889US8172646B2Magnetically actuated chuck for edge bevel removalFENG JINGBIN·Filed 2009·Granted May 8, 2012·16 cites·27 claims
- 0985US9138784B1Deionized water conditioning system and methodsHawkins jeffrey alan·Filed 2010·Granted Sep 22, 2015·15 cites·8 claims
- 1083US8419964B2Apparatus and method for edge bevel removal of copper from silicon wafersGANESAN KOUSIK·Filed 2008·Granted Apr 16, 2013·11 cites·23 claims
- 1178US10658281B2Integrated circuit substrate and method of makingINTEL CORP·Filed 2017·Granted May 19, 2020·2 cites·5 claims
- 1278US8540857B1Plating method and apparatus with multiple internally irrigated chambersMAYER STEVEN·Filed 2012·Granted Sep 24, 2013·1 cites·22 claims
- 1375US9816193B2Configuration and method of operation of an electrodeposition system for improved process stability and performanceGANESAN KOUSIK·Filed 2011·Granted Nov 14, 2017·1 cites·16 claims
- 1467US10745817B2Configuration and method of operation of an electrodeposition system for improved process stability and performanceNOVELLUS SYSTEMS INC·Filed 2017·Granted Aug 18, 2020·0 cites·19 claims
- 1557US2012181170A1Wafer electroplating apparatus for reducing edge defectsPRABHAKAR VINAY·Filed 2012·Application pending·0 cites
- 1657US2020211952A1Integrated circuit substrate and method of makingINTEL CORP·Filed 2020·Application pending·0 cites
- 1746US2022199503A1Novel lga architecture for improving reliability performance of metal defined padsINTEL CORP·Filed 2020·Application pending·0 cites
- 1839US2020006273A1Microelectronic device interconnect structureINTEL CORP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →