Inventor · disambiguated record
Koichi Hattori
Also filed as: HATTORI KOICHI
12 granted patents·2 pending applications·15 citations·filing 2009–2023
83Inventor score
Files withDENSO CORP4NIPPON STEEL CHEMICAL & MAT CO LTD4FUJISAWA SATOSHI2HATTORI KOICHI1HITACHI SYSTEMS LTD1
Top patents by PatentIndex Score
14 records- 0192US11702502B2Epoxy resin composition and cured productNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2020·Granted Jul 18, 2023·2 cites·9 claims
- 0286US8557392B2Flexible copper clad laminateFUJISAWA SATOSHI·Filed 2009·Granted Oct 15, 2013·8 cites·5 claims
- 0374US9127638B2Control apparatus for internal combustion engineDENSO CORP·Filed 2013·Granted Sep 8, 2015·3 cites·19 claims
- 0460US11306178B2Epoxy resin composition and cured productNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2019·Granted Apr 19, 2022·0 cites·12 claims
- 0560US9702332B2Ignition deviceDENSO CORP·Filed 2013·Granted Jul 11, 2017·1 cites·12 claims
- 0658US12116044B2Frame which is made of fiber reinforced compositeMAZDA MOTOR·Filed 2022·Granted Oct 15, 2024·0 cites·10 claims
- 0757US11059949B2Prepreg and molding product thereofNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2019·Granted Jul 13, 2021·0 cites·6 claims
- 0853US2024231340A9Use resource setting method and use resource setting deviceHITACHI SYSTEMS LTD·Filed 2023·Application pending·0 cites
- 0950US11396597B2Epoxy resin composition and cured object obtained therefromNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2018·Granted Jul 26, 2022·0 cites·6 claims
- 1048US2014254114A1Flexible circuit board and method for producing same and bend structure of flexible circuit boardNIPPON STEEL & SUMIKIN CHEM CO·Filed 2014·Application pending·0 cites
- 1147US9060432B2Flexible circuit board and method for producing same and bend structure of flexible circuit boardHATTORI KOICHI·Filed 2009·Granted Jun 16, 2015·1 cites·4 claims
- 1242US9022010B2Ignition systemDENSO CORP·Filed 2013·Granted May 5, 2015·0 cites·4 claims
- 1340US9488151B2Ignition systemDENSO CORP·Filed 2012·Granted Nov 8, 2016·0 cites·13 claims
- 1437US8852754B2Surface-treated copper foil, method for producing same, and copper clad laminated boardFUJISAWA SATOSHI·Filed 2011·Granted Oct 7, 2014·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →